Method for Coating a Substrate with a Hollow Structure

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This patent describes a method for efficiently coating substrates that have internal hollow (cavity) structures, such as cooling channels, with thermal barrier coatings (TBCs). The process involves first applying a bonding or diffusion metallic layer, and then depositing a thermal protection layer using advanced coating techniques like plasma spray physical vapor deposition (PS-PVD), hollow cathode sputtering, or suspension plasma spray (SPS). The method is specifically designed to avoid blocking the small openings of the internal cavities, preserving their functionality, particularly for cooling applications in high-temperature environments.

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• Coating turbine blades or components in aircraft engines that have internal cooling channels.
• Protecting burners or liners in combustion chambers exposed to extreme heat.
• Applying durable, heat-resistant coatings to industrial parts in power plants or manufacturing equipment that feature internal hollow structures for fluid flow or cooling.
• Producing parts via additive manufacturing (3D printing) that require both complex internal cooling and high-performance thermal coatings.

BenefitsContent extracted from patent full text and abstract with AI.

• Maintains the integrity and function of internal cavity openings, reducing or eliminating post-coating rework such as laser drilling.
• Enhances thermal resistance and lifetime of metallic components exposed to extreme temperatures.
• Improves manufacturing efficiency by permitting direct coating of complex, internally-cooled parts.
• Reduces the risk of blocking cooling channels, thus ensuring effective cooling and component reliability.
• Compatible with modern manufacturing methods such as additive manufacturing, allowing advanced component designs to be realized.

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Patent Abstract

A method for coating a substrate having a cavity structure, in particular a cooling structure, inside the substrate, wherein the cavity structure includes openings in the surface of the substrate. At least one bonding layer, in particular a diffusion layer, or at least one metallic layer is applied onto the substrate, in particular onto the surface of the substrate, and subsequently at least one thermal protection layer is applied onto the at least one diffusion layer by using a plasma spray physical vapour deposition (PS-PVD) method, a hollow cathode sputtering method or a suspension plasma spray (SPS) method.