Method for Mechanical Assembly of van der Waals Heterostructures and Stamp Set

Publication: DE102023115602A1
Published: 2024-12-19
Family Size: 2
Granted: No

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention provides a new mechanical process for assembling van der Waals heterostructures (complex layered materials made of 2D crystals such as graphene, MoS2, or h-BN) using a specially designed set of polymer-based stamps. The technique allows for the construction and transfer of these structures to a target substrate while minimizing contamination and damage, enabling atomic-level cleanliness and structural quality without the need for high-temperature processing or chemical cleaning steps.

Use CasesContent extracted from patent full text and abstract with AI.

  • Fabrication of ultra-clean and defect-free van der Waals heterostructures for research in condensed matter physics or material science.
  • Development and production of advanced nanoelectronic, optoelectronic, and quantum devices using layered 2D materials.
  • Preparation of heterostructures for sophisticated surface analysis techniques such as scanning tunneling microscopy (STM) or atomic force microscopy (AFM) studies.
  • Creation of device prototypes utilizing air-sensitive or reactive 2D materials that require clean interfaces for functional performance.
  • Industrial manufacturing of 2D material-based transistors, sensors, or memory devices with superior quality interfaces.

BenefitsContent extracted from patent full text and abstract with AI.

  • Achieves atomic cleanliness at the interfaces of 2D material stacks without additional chemical cleaning or protective layers.
  • Reduces processing temperature, making the method compatible with temperature-sensitive and reactive materials.
  • Avoids polymer residue and related contamination common in existing transfer methods.
  • Enables the construction of complex heterostructures from a wide variety of 2D materials, expanding research and industrial application possibilities.
  • Improves mechanical integrity of transferred layers, prevents breakage and formation of wrinkles or bubbles.
  • Suitable for use within gloveboxes or ultra-high vacuum (UHV) setups, allowing the handling of air-sensitive materials.

Technical Classifications (CPCs)

Main Classifications

Chemistry & Materials Science

Manufacturing & Transport

Sub Classifications

Inorganic Chemistry

Microstructural Technology

Nanotechnology

CPC Codes

B81C1/00373B82B3/0047C01B21/064C01B32/19

Inventors & Applicants

Applicants

Forschungszentrum Juelich Gmbh

Patent Abstract

The present invention relates to a method for mechanically creating van der Waals heterostructures and to a set of stamps which is designed for mechanically creating van der Waals heterostructures and in particular for carrying out the method.

Key Information

Publication No.

DE102023115602A1

Family ID

91782051

Publication Date

2024-12-19

Application No.

DE102023115602A

Application Date

2023-06-15

Priority Date

2023-06-15

Granted

No

Possible Cooperation

For further information please contact the transfer office.