Method and Device for Thermal Spraying Process

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This patent describes a specialized thermal spraying process and apparatus for coating substrates where, immediately after a coating layer is deposited, both the layer and the substrate are cooled in a controlled manner. The process ensures that the temperature remains significantly higher than the ambient environment for a short period before cooling is precisely applied to the just-coated area. This results in improved coating properties, such as high-density thin gas-tight layers or thicker, highly segmented coatings with better structural characteristics and fewer detrimental cracks.

Use CasesContent extracted from patent full text and abstract with AI.

• Producing gas-tight ceramic membrane coatings for solid oxide fuel cells (SOFCs)
• Creating protective thermal barrier coatings on turbine blades and engine parts
• Applying corrosion and oxidation-resistant coatings in harsh environments (e.g., chemical plants, power generation)
• Manufacturing dense insulating or conductive layers for electronic and energy devices
• Producing specialized separation membranes for gas or ion separation applications

BenefitsContent extracted from patent full text and abstract with AI.

• Enables production of very dense, gas-tight thin coatings with improved adhesion to substrates
• Allows for thicker coatings with high segmentation crack densities without harmful delamination
• Reduces risk of substrate damage (such as warping, corrosion or oxidation) due to better temperature management
• Improves microstructural qualities of coatings, leading to enhanced operational lifetimes and reliability
• Provides flexibility in coating materials and thickness for various industrial applications
• Allows coatings to be applied to complex 3D shapes and surfaces with precise control over cooling and heat exposure

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Inventors & Applicants

Patent Abstract

The invention relates to a process for coating a substrate by means of a thermal spraying process, in which the deposited layer and also the substrate are cooled after the spray transit. According to the invention, defined cooling of the deposited layer and also the substrate takes place in such a way that the average temperature level in the layer/substrate composite is at least 200 K above ambient temperature. It is advantageous for a time of less than 100 ms, in particular less than 10 ms and in particular in the range from 0.1 to 5 ms, to elapse between the spray transit and the defined cooling of this deposited layer. The increased temperature level associated with the defined cooling after application makes it possible, by means of this process, firstly to produce thin, gastight layers having a thickness of 100 µm) having a high segmentation crack density.