Joining of metallic and/or ceramic materials with the help of a glass ceramic filler material and a laser beam ; Joint with two metallic and/or ceramic materials parts
Simple SummaryContent extracted from patent full text and abstract with AI.
This invention describes a laser-assisted joining method for connecting two metallic and/or ceramic components using a glass-ceramic filler material. The process involves drilling a hole with a focused laser in one component, introducing a binder-free glass-ceramic filler, and then melting this filler with a defocused laser to form a gas-tight, robust bond between the parts. The filler is added as a powder, often via a vibration unit, and the laser operation is precisely controlled for high-quality, localized (point-like) joints without the need for binders that could cause defects.
Use CasesContent extracted from patent full text and abstract with AI.
- Manufacturing and assembly of solid oxide fuel cells (SOFCs), where gas-tight and electrically insulating joints are essential at high temperatures.
- Joining advanced electronic or sensor devices that use both metal and ceramic substrates requiring precise, clean, and localized bonding.
- Production and repair of medical devices or implants involving combinations of ceramic and metal components.
- Aerospace and automotive applications where strong, gas-tight, and thermally stable joints between metals and ceramics are required.
- Microjoining and hermetic sealing in miniaturized or MEMS devices involving metallic and ceramic elements.
BenefitsContent extracted from patent full text and abstract with AI.
- Enables strong, gas-tight, and durable joints between dissimilar materials (metal and/or ceramic) even at high operating temperatures.
- Uses a binder-free glass-ceramic filler, avoiding porosity and defects caused by burning traditional binders.
- Allows precise, localized (point-like) joining with minimal thermal impact on surrounding materials, suitable for delicate components.
- Laser-based process provides contactless, highly controllable heating and melting, improving quality and repeatability.
- Capable of both manual and automated operation, supporting flexible integration into different manufacturing environments.
- Reduces the risk of damaging sensitive components compared to high-temperature conventional methods like furnace brazing.
Technical Classifications (CPCs)
Main Classifications
Chemistry & Materials Science
Electrical & Electronic Tech
Manufacturing & Transport
Sub Classifications
Cements, Concrete & Ceramics
Electric Elements
Machine Tools & Metal-Working
CPC Codes
Inventors & Applicants
Applicants
Forschungszentrum Juelich Gmbh
Patent Abstract
The method comprises creating a hole in one of the components to be connected using a focused laser, supplying a bore of a ceramic filler material, melting the glass-ceramic filler material by energy input of the defocused laser, forming a gas-tight material connection between the components to be joined, inserting a carbon dioxide laser, a neodymium:yttrium aluminum garnet (Nd:YAG) laser, a fiber laser or a laser disc, and establishing a point-like joint connection. A binder-free solder is used as a glass-ceramic filler. The powdered glass solder is added on one side of a vibration unit. The method comprises creating a hole in one of the components to be connected using a focused laser, supplying a bore of a ceramic filler material, melting the glass-ceramic filler material by energy input of the defocused laser, forming a gas-tight material connection between the components to be joined, inserting a carbon dioxide laser, a neodymium:yttrium aluminum garnet (Nd:YAG) laser, a fiber laser or a laser disc, and establishing a point-like joint connection. A binder-free solder is used as a glass-ceramic filler. The powdered glass solder is added on one side of a vibration unit. The focusing/defocusing of the laser is carried out by a relative movement of the laser to the components to be joined by an optical device. The components to be joined are arranged in an assembly at a distance of 0.1-2 mm. The laser is continuously operated during the entire assembly process. The first component at the site of drilling exhibits a maximum thickness of 1.5 mm. The bonding material is added to the drilling site prior to the creation of the hole in the first component of bonding material, and the bonding material is melted by the energy input of the laser. The laser drilling of the first component is carried out through the melted bonding material, so that the drilling of molten joining material is carried out through the bore between the components to be joined. An independent claim is included for a joint between two metal and/or ceramic surface components.
Key Information
Publication No.
EP2380690A1
Family ID
44509880
Publication Date
2011-10-26
Application No.
EP11002397A
Application Date
2011-03-23
Priority Date
2010-04-26
Granted
Yes (1/3)
Possible Cooperation
For further information please contact the transfer office.