Solder Material, Use of the Solder Material in a Solder Paste, and Method for Producing a Solder Joint Using the Solder Material

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The invention relates to a novel solder paste composed of nanocrystalline metallic and/or semimetallic particles, optionally combined with nanocrystalline oxide particles. When ignited locally (for example, by a heating coil), the mixture undergoes a controlled, self-sustaining exothermic reaction, similar to a thermite reaction, producing enough heat to join components by forming intermetallic phases at lower overall temperatures. The ratio and particle size can be adjusted to specifically tailor the soldering process, making it suitable for sensitive parts.

Use CasesContent extracted from patent full text and abstract with AI.

• Soldering temperature-sensitive electronic components, such as microchips and processors, without causing thermal damage.
• Joining metals to ceramics, especially for applications in electronics and sensors.
• Manufacturing hermetically sealed joints for devices requiring reliable, long-term stability (e.g., medical implants, aerospace components).
• Micro-joining or microassembly where precise, localized heating is necessary.
• Repair processes for delicate devices where conventional high-temperature soldering is risky.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables soldering of heat-sensitive components due to low and localized thermal load.
• Reduces thermal damage to surrounding materials, preserving integrity and performance of assemblies.
• Provides strong, gastight, and long-term stable connections between various material types, including metals and ceramics.
• Adjustable composition allows customization for different application needs and materials.
• No need for special equipment like vacuum chambers or high-temperature ovens—soldering can be performed under inert gas or even at ambient pressure.
• Potentially simplifies the process and increases flexibility for advanced manufacturing and repair.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a solder paste, comprising a mixture of nanocrystalline metallic and/or semimetallic and optionally oxidic particles, wherein the nanoparticles have an average diameter between 1 and 1000 nm, in particular between 2 and 500 nm. The mixture reacts completely and in a self-propagating manner, as in a thermite reaction, after the mixture has been ignited by a heating coil. However, in contrast to a thermite reaction, the nanocrystalline metallic and/or semimetallic particles react in an exothermic reaction to form an intermetallic phase. By means of the selected ratio of metallic or semimetallic and oxidic particles and the selection of the particle sizes, the soldering reaction and thus the soldering result can be controlled and advantageously adapted to the problems of the components to be connected, which is especially advantageous in the case of temperature-sensitive components.