Three-Dimensional Microelectrode Arrays and Manufacturing

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention covers three-dimensional microelectrode arrays (3D MEAs) built by stacking multiple two-dimensional microelectrode arrays on top of one another, where the individual layers are flexible. The stacked structure allows electrodes to be distributed across multiple planes rather than a single flat surface, enabling volumetric coverage of biological tissue. The patent also describes manufacturing methods for producing these 3D MEAs and related kit-of-parts configurations. These devices are designed for both recording electrical signals from tissue and delivering electrical stimulation to it.

Use CasesContent extracted from patent full text and abstract with AI.

• Recording neural activity from three-dimensional brain tissue slices or organoids in neuroscience research, capturing signals from multiple depths simultaneously.
• Delivering precise deep-brain stimulation therapy for conditions such as Parkinson's disease or epilepsy using volumetrically distributed electrode contacts.
• Monitoring cardiac electrophysiology across the full thickness of heart muscle tissue to detect arrhythmias or conduction disorders.
• Interfacing with spinal cord tissue for neuroprosthetic applications, providing multi-layer electrode coverage along the cord's cross-section.
• Fabricating implantable cortical probes that conform to curved brain surfaces while sampling from multiple cortical layers at once.
• Serving as a research platform (kit-of-parts) for labs to assemble customized 3D electrode configurations for in-vitro electrophysiology experiments on 3D cell cultures.

BenefitsContent extracted from patent full text and abstract with AI.

• Volumetric electrode coverage allows simultaneous recording and stimulation across multiple tissue depths, which flat 2D arrays cannot achieve.
• Use of flexible 2D layers as building blocks reduces mechanical stiffness of the final 3D structure, minimizing tissue damage and improving biocompatibility.
• Stacking approach enables scalable fabrication by reusing established 2D MEA manufacturing processes rather than requiring entirely new 3D microfabrication techniques.
• Modular kit-of-parts design allows researchers and clinicians to customize electrode density, layer spacing, and geometry for specific anatomical targets.
• Higher spatial resolution in three dimensions improves the accuracy of neural signal source localization compared to single-plane electrode arrays.
• Flexible interlayer connections accommodate natural tissue movement and deformation, reducing electrode displacement and signal degradation over time.

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Patent Abstract

The present invention relates to three-dimensional microelectrode arrays, methods for producing three-dimensional microelectrode arrays, each based on stacked, in particular flexible, two-dimensional microelectrode arrays, corresponding uses and kit-of-parts.