A method of applying a material on a substrate

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a novel method for applying materials, especially patterned materials, onto hard substrates using a precisely controlled pressure process. By enclosing the substrate and the patterned stamp in a pressure chamber, varying pressure conditions are used to generate uniform and high-fidelity transfer of materials with feature sizes as small as 30 nanometers or less. The approach allows the use of hard, high-modulus materials for both the substrate and the stamp, overcoming limitations seen with soft lithography regarding pattern size and transfer quality.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of micro- and nano-scale electronic devices (such as integrated circuits, MEMS, and sensors) where high-resolution patterning is required.
• Fabrication of high-density data storage devices using nanoscale patterning.
• Creating advanced biosensors and lab-on-a-chip devices by accurately printing proteins or other biomolecules at nanoscales onto substrates.
• Production of nanophotonic structures and metasurfaces for optical and photonic applications.
• Transferring molecular or nanoparticle-based inks for displays, flexible electronics, or OLED devices.
• Patterning of hard surfaces for microfluidic channels or surface functionalization in biomedical devices.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables transfer of patterns with features as small as ≤30 nm, surpassing traditional soft lithography limits.
• Allows for the use of hard materials for both the stamp and substrate, reducing pattern deformation and increasing fidelity.
• Provides uniform printing over large areas, scalable up to 12-inch substrates.
• Defect tolerant: local defects like dust only affect small areas of transfer.
• Adjustable and precise pressure control allows for process optimization and reproducibility.
• Simple, single-step fabrication of polymer stamps, making the process cost-effective and accessible.
• Accommodates both organic and inorganic materials (including metals, proteins, nanoparticles).
• Process compensates for non-uniformities in the stamp pattern, improving tolerance and yield.

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Patent Abstract

The present invention relates to a method of applying a material, preferably a pattern of material on a substrate.