Method for Manufacturing an Electronic Component by Means of a Wall and Component

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a method for manufacturing electronic components, such as transistors or diodes, by introducing upright walls on a substrate. These walls act as reusable, built-in masks during the deposition of various materials, allowing for precise and selective deposition and doping of semiconductor layers. The direction of material deposition relative to these walls determines which areas get coated or remain unaffected, eliminating the need for traditional removable masks. The invention also covers electronic devices created using this process.

Use CasesContent extracted from patent full text and abstract with AI.

• Production of advanced field-effect transistors with precisely defined channels and contacts.
• Manufacturing of optoelectronic devices such as photodetectors or LEDs with selective doping regions.
• Creation of high-quality semiconductor layers with minimal lattice defects for quantum computing components.
• Fabrication of microelectronics on compound semiconductor wafers (GaAs, ZnSe, etc.) for improved device integration.
• Selective in-situ doping of electronic and optoelectronic devices during vacuum deposition processes.

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces manufacturing steps by eliminating the need for traditional mask placement and removal between processes.
• Enhances manufacturing precision by using permanent or semi-permanent walls for selective material deposition and doping.
• Enables the production of high-purity, defect-minimal semiconductor layers entirely under vacuum, boosting device performance.
• Reduces defect rates and improves device yield by minimizing contamination and lattice damage.
• Allows for flexible device architecture, enabling unique structures such as buried channels or isolated sections of semiconductor devices.
• Supports in-situ tuning of doping and layer composition without interrupting the vacuum process, saving time and reducing complexity.
• Suitable for both research and industrial-scale semiconductor device fabrication.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a method for producing an electronic component, comprising the steps of: providing a substrate (1) with a wall (2) which projects from a surface of the substrate (1), depositing a first substance on the exposed surface of the substrate (1) or an exposed surface of a layer (8, 10) which is applied to the surface of the substrate (1), wherein the first substance is deposited in a direction at an angle to the wall (2) and as a result the substance is deposited on one side of the wall (2) at a distance to the wall (2) on the exposed surface. The invention also relates to a component produced according to the method.