A method of preparing a substrate having a layer or pattern of metal on it

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention discloses an improved method for transferring a thin metal layer or metal pattern onto a target substrate by first applying a flexible, functionalized polymer layer to the substrate. The polymer acts as a 'roughness compensating layer' to ensure intimate contact and strong adhesion of the metal, even on rough or nanostructured surfaces. The method enables precise transfer of metal features using a stamp, such as a polymeric stamp, and can be used with various metals and substrate materials.

Use CasesContent extracted from patent full text and abstract with AI.

• Fabrication of microelectronic or nanoelectronic circuits with patterned metal electrodes.
• Production of sensors and biosensors where metal patterns on insulators or semiconductors are needed.
• Manufacturing of thin-film or flexible electronic devices, such as wearable electronics and displays.
• Creation of nanostructured metal patterns for plasmonic or photonic devices.
• Micro-patterning of metals on chips for MEMS (Microelectromechanical Systems) or lab-on-a-chip applications.
• Transfer of patterned metal contacts onto delicate substrates for medical devices or implantable electronics.

BenefitsContent extracted from patent full text and abstract with AI.

• Provides strong adhesion and reliable transfer of metal layers/patterns to the target substrate by compensating for surface roughness.
• Reduces the likelihood of incomplete or inefficient transfer, leading to higher manufacturing yields and reproducibility.
• Versatile: works with a variety of metals (Au, Ag, Pt, etc.), polymers, and substrates (Si, glass, ceramics, semiconductors).
• The process can be done under mild conditions, without high pressure or temperature, reducing damage to sensitive substrates.
• Enables fabrication of highly precise and small-scale metal features, suitable for advanced nanotechnology applications.
• The method can be adapted for both planar and non-planar/structured surfaces, increasing its applicability.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The present invention relates to a method of preparing a substrate having a layer or pattern of metal on it, to a substrate prepared by such method and to uses thereof.