Device for Controlled Heat Transfer to and from a Component

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The invention relates to a device for controlled heat transfer to or from a component, particularly suitable for applications requiring temperature regulation up to 1500°C. The core invention is a coupling mechanism in which a component is mounted above a carrier plate with at least one spacer element forming a sealed cavity in between. This cavity can be either evacuated (to provide thermal insulation) or filled with a fluid (to improve heat transfer), and can be supplied or evacuated via dedicated inlet/outlet ports. By adjusting the state or contents of the cavity, the heat transfer to or from the component can be actively and precisely controlled, allowing reliable heating or cooling of the component in a repeatable manner.

Use CasesContent extracted from patent full text and abstract with AI.

• Testing and analysis of material samples (e.g., for plasma-wall interaction studies in fusion reactors) under precisely controlled temperatures.
• Thermal cycling and stress simulations for advanced materials in research and development.
• Components in high-temperature reactors or test benches that require both heating and cooling phases.
• Precision temperature regulation of sensitive components in vacuum or inert atmosphere environments.
• Industrial or scientific apparatus demanding reliable, reproducible heat transfer characteristics, even with frequent replacement of test specimens.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables precise, adjustable control of heat transfer by changing the medium (vacuum or fluid) in the cavity, allowing for stable and targeted temperature management.
• Supports operation at extremely high temperatures (up to 1500°C), well beyond conventional methods.
• Reduces thermal contact resistance and allows reproducible contact conditions, important for experimental consistency and repeatability.
• Facilitates quick exchange of components or test samples without compromising heat transfer efficiency or causing contamination.
• Designed to minimize undesired heat loss or gain, improving experimental reliability and energy efficiency.
• Can be adapted to various component shapes and sizes, including planar and complex 3D geometries.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a component coupling means for deliberate and controllable heat transfer from or to a component (3), which can be heated by an external and/or internal heat source and which is arranged adjacent to a cooler (7). The component coupling means comprises a carrier plate (1), on which at least one first element for spacing (2a) is arranged in such a way that a component (3) arranged on the element for spacing and the carrier plate (1) together with the element for spacing (2a) are able to form a first defined cavity (4a). If necessary, said cavity can be evacuated or filled with a fluid medium or flow can pass through said cavity, whereby the heat transfer or the heat loss from the component can be controlled in a simple manner.