Method for Manufacturing a Solar Module and a Solar Module

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention presents a method for manufacturing a solar module in which a wet-chemical etching step is introduced between the deposition of active semiconductor layers and the application of the second electrical contact layer. This etching step removes exposed portions of the first contact layer, preventing unwanted electrical short circuits between the contact layers, which commonly occur in conventional solar cell fabrication. As a result, the method enables higher module efficiency and faster, less complex production processes.

Use CasesContent extracted from patent full text and abstract with AI.

• Production of high-efficiency thin-film solar modules for commercial and residential photovoltaic installations
• Manufacture of tandem or multilayered solar panels with a variety of semiconductor materials
• Integration into roll-to-roll or large-scale industrial solar module fabrication lines
• Application in the production of large-area solar panels for solar farms or building-integrated photovoltaics
• Use in manufacturing displays or electronic devices with similar layered structures to avoid electrical shorts

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces risk of electrical short circuits between contact layers, improving yield and module reliability
• Enables higher energy conversion efficiency in solar cells by eliminating loss pathways
• Simplifies manufacturing processes by reducing masking steps and complexity
• Allows for faster production cycles and potentially lower manufacturing costs
• Applicable to a wide range of semiconductor and contact materials, enhancing process flexibility
• Can improve performance consistency and decrease defect rates in mass production

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a method for producing a solar module comprising the following steps: a) a first electrical contact layer (2) is arranged on a substrate (1), b) active semiconductor layers (3) are arranged on the first electrical contact layer (2), c) a second electrical contact layer (4) is arranged on the active semiconductor layers (3), characterized in that a wet-chemical etching step is carried out between step b) and step c).