A method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate

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This patent describes a versatile method for forming highly precise patterns of metals, metal oxides, or semiconductor materials onto various substrates, using a transfer process that can achieve nanoscale resolutions (≤ 10 nm). The technique generally involves creating a pattern on an initial substrate, optionally using lithography and/or lubricant or transfer-mediating layers to control adhesion, and then transferring the pattern to a target substrate (which may be flexible or multi-layered), with minimal surface roughness and smooth edges.

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• Fabrication of advanced electronic circuits (including nanoscale interconnects/devices)
• Production of organic light-emitting diodes (OLEDs), field effect transistors (OFETs), and molecular electronic devices
• Manufacture of biosensors and biomedical chips requiring precise patterning at the nanoscale
• Creation of flexible electronic devices by transferring patterns onto polymeric substrates
• Patterning of semiconductor, metal, or oxide layers in photovoltaics or optoelectronics
• Preparation of nanostructured surfaces for research or advanced material science applications

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• Enables extremely high-resolution patterning (down to ≤ 10 nm), exceeding conventional soft lithography methods
• Compatible with a wide range of materials (various metals, oxides, semiconductors) and substrates (rigid, flexible, organic, inorganic)
• Produces patterns with very low surface roughness (≤ 2 nm) and smooth, well-defined edges
• Can be performed under ambient conditions—simplifying the manufacturing process and reducing costs
• Minimizes introduction of defects such as atomic diffusion, preserving the integrity of organic and functional layers
• Adaptable to several lithographic techniques and scalable for industrial production
• Non-destructive transfer process preserves molecular and electronic properties between layers

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Patent Abstract

The present application relates to a method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate, to a pattern created by such method and to uses of such pattern.