Device and Method for Thermal Treatment of Workpieces

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention relates to a device and method for the thermal treatment of workpieces, utilizing multiple LED light units to direct and focus light onto a designated process zone. The LED units are arranged with optics to control the light density and focus, allowing precise heating where needed.

Use CasesContent extracted from patent full text and abstract with AI.

• Heat treatment of industrial components to alter material properties.
• Selective surface treatment in manufacturing (e.g., hardening or annealing).
• Precision soldering or activation of adhesives in electronics production.
• Thermal processing of ceramics, glass, or composite materials.
• Controlled curing processes for coatings or resins.

BenefitsContent extracted from patent full text and abstract with AI.

• Highly precise thermal control with targeted heating areas.
• Efficient use of energy using LEDs instead of traditional heat sources.
• Minimized heat impact on surrounding material, reducing deformation risks.
• Flexible setup for various workpiece sizes and shapes.
• Potential for automation and integration into advanced manufacturing lines.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The present invention relates to a device and a method for thermal treatment of workpieces (18), with a process zone (13) having a process zone size (21), at least two light-emitting units (6), wherein each light-emitting unit has at least one LED (5) for irradiating light (15) into the process zone and an optical system (7) for influencing the irradiated light, wherein each LED has an LED power density (PL) on an LED light-emitting surface (4), wherein each light-emitting unit is assigned a central beam (1), wherein the dimensions of the respective light-emitting unit define a respective light-emitting unit size (17), wherein the respective distance between the process zone and the respective light-emitting unit defines a respective working distance (19), wherein the irradiated light in the process zone produces a process zone power density (PP), and a holder (8) for holding the light-emitting units, wherein the holder is configured to hold the light-emitting units such that the central beams penetrate the process zone and a bundling of the irradiated light takes place.