Isolator for Cryoelectric Chips at Extremely Low Temperatures Below 10K

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This patent describes an isolator system designed for coupling two cryoelectronic chips operating at extremely low temperatures (below 10K) but at different temperatures, while ensuring effective thermal insulation. The system employs a layered Bragg reflector structure with specifically engineered materials and geometries to reduce thermal conduction (phonon transport) between the chips, while allowing dense electrical interconnection via superconducting pathways. The technology is tailored to support, for example, quantum computing chips where extremely low and controlled temperatures are crucial.

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• Enabling communication and control between quantum computing chips (Qubit chips) and their classical control/readout electronics operated at different cryogenic temperatures.
• Integrating high-density superconducting interconnects in systems requiring extreme thermal isolation, such as quantum sensors or photonic circuits.
• Thermal management solutions in advanced semiconductor devices functioning at cryogenic temperatures for scientific research or specialized computation.
• Facilitating scalable multi-chip modules for quantum processors by reducing thermal crosstalk.
• Providing infrastructure for hybrid systems combining classical and quantum electronics on a single platform.

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• Drastically reduces unwanted heat flow (thermal crosstalk) between low-temperature chips, vital for stable quantum operation.
• Allows much higher density of electrical connections between chips without significantly increasing thermal conductance.
• Enables integration of classical control/readout chips with quantum processors, expanding system scalability and capability.
• Employs superconductive interconnects to further reduce heat generation and conduction, improving efficiency.
• The modular, scalable design (including cascaded Bragg reflectors) allows for isolation over a wide range of temperature gradients.
• Supports usage of widely available materials like porous silicon, enhancing manufacturability and adaptability.

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Patent Abstract

The invention relates to an insulator system (20) between two chips (10, 12), which are operated at different temperatures below 10 K while thermally insulated from each other, wherein information is exchanged between a first chip (10) and a second chip (12) of the two chips (10, 12) by means of a connection system (14) composed of electrical connections (16).