Manufacture of Electronic Components on a Substrate

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This patent describes a method for manufacturing electronic components, such as solar cells or OLEDs, on a transparent substrate. The process involves depositing a laser-removable, electrically conductive layer (such as metal) on a substrate transparent to laser light, adding necessary functional layers, and then using laser pulses to detach the conductive layer and thus separate the electronic component from the substrate without damaging either. The substrate can then be reused for further production, and the process can also accommodate both flexible and rigid backing materials.

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• Manufacturing flexible solar cell films that can be mounted on curved surfaces (e.g., car roofs, building facades)
• Production of organic solar cells and OLED displays that require encapsulation or specialized substrates
• Creation of electronic devices on high-quality, expensive, or structured substrates, which are subsequently reused to lower costs
• Fabrication of large-area electronic films by roll-to-roll processes using a rotating transparent drum as the substrate
• Production of thin-film photovoltaic modules (CIGS, CdTe, Perovskite, etc.) and flexible electronic circuits
• Development of micro-structured or three-dimensional electronic devices by using structured or pre-treated substrates

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces manufacturing costs by allowing reuse of expensive or complex substrates
• Enables production of flexible and lightweight electronic components suitable for diverse and irregular surfaces
• Minimizes damage to both device layers and substrates during separation, preserving material quality
• Facilitates use of advanced substrate materials (e.g., single crystals, nano-patterned, curved), enhancing device performance and customization
• Improves scalability and throughput, especially via roll-to-roll processing methods
• Enhances device encapsulation options, leading to better durability for sensitive components like organic solar cells
• Allows precise structuring of device layers before separation, improving device integration and interconnectivity

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Inventors & Applicants

Patent Abstract

The present invention relates to a method for producing electronic components on a transparent substrate. The present invention pursues the aim of producing electronic components on substrates without having to rely on inexpensive and therefore technically simple substrates. In order to achieve the object, a substrate is provided which is transmissive to light from a laser used. There is applied to the substrate a layer which is fusible or evaporable by laser light, preferably a metal layer, specifically for example a layer consisting of silver or a layer consisting of aluminum. Further layers required for producing the desired electronic component are applied thereto. After the partial or complete production of the electronic component on the substrate, the layer which is fusible or evaporable by laser light is detached from the substrate, specifically by light from the laser used which is directed through the substrate onto the layer which is fusible or evaporable by laser light, in order thus to separate the layer which is fusible or evaporable by laser light.