Arrangement for Hall Effect Measurements on Samples and Method for Producing an Arrangement for Hall Effect Measurements on Samples

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This invention relates to an arrangement and a manufacturing method for Hall effect measurements on samples. The system comprises a substrate with four electrical contact points arranged in a van der Pauw geometry, which are formed directly on the substrate using a coating process. A thin sample layer can be deposited directly onto the substrate and comes into direct contact with the contact points, enabling efficient and precise Hall effect measurements.

Use CasesContent extracted from patent full text and abstract with AI.

• Measuring the electrical properties (such as carrier concentration and mobility) of semiconductor thin films in research and development labs.
• Quality control in the manufacturing of semiconductor wafers and thin-film devices.
• Characterization of new materials in academic or industrial laboratory settings.
• Determination of material properties for development of sensors or electronic devices.

BenefitsContent extracted from patent full text and abstract with AI.

• Direct deposition of electrical contacts allows for better electrical contact and measurement accuracy.
• Enables non-destructive, precise Hall effect measurement of thin film samples.
• Simplifies the sample preparation process by integrating contact points during fabrication.
• Supports rapid and reproducible measurements, beneficial for high-throughput testing.

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Patent Abstract

Die Erfindung betrifft eine Anordnung für Hall-Effekt-Messungen an Proben und ein Verfahren zur Herstellung der Anordnung. Die Anordnung umfasst mindestens ein Substrat 1, 1' und vier elektrische Kontaktpunkte 31,2,3,4, 3'1,2,3,4, die für eine Messung in einer van-der-Pauw-Geometrie auf einer ersten Oberfläche O, O' des Substrats 1, 1' angeordnet sind und wobei die elektrischen Kontaktpunkte 31,2,3,4, 3'1,2,3,4durch Beschichtung direkt auf dem Substrat 1, 1' herstellbar sind, so dass eine dünne Schicht 2, 2' als zu messende Probe durch Beschichtung auf der ersten Oberfläche O, O' des Substrats 1, 1' mit direktem Kontakt zu den elektrischen Kontaktpunkten 31,2,3,4, 3'1,2,3,4aufbringbar ist.