Coating device for substrate, comprises atomizing chamber, in which coating solution or coating dispersion is converted into aerosol by series of ultrasound sources having ultrasonic atomizer
Simple SummaryContent extracted from patent full text and abstract with AI.
This patent describes a coating device designed to apply a uniform layer of material onto a substrate. It utilizes an atomizing chamber equipped with multiple ultrasound sources and an ultrasonic atomizer to convert a coating solution or dispersion into an aerosol, which is then evenly distributed across the width of the substrate using a flat sheet die.
Use CasesContent extracted from patent full text and abstract with AI.
- Applying protective or functional coatings to electronic circuit boards or displays.
- Manufacturing solar panels which require uniform thin-film coatings.
- Producing coated paper or packaging materials for enhanced properties (e.g., water resistance, printability).
- Pharmaceutical tablet coating for controlled release or flavor masking.
- Creating anti-reflective or hydrophobic coatings on glass or plastic surfaces.
BenefitsContent extracted from patent full text and abstract with AI.
- Provides a highly uniform and controlled coating across large substrate areas.
- Enables fine control over the thickness and quality of the applied layer.
- Ultrasonic atomization reduces overspray and waste of expensive materials.
- Suitable for a wide range of coating solutions, including delicate or sensitive materials.
- Potentially scalable for industrial mass production with consistent results.
Technical Classifications (CPCs)
Main Classifications
Manufacturing & Transport
Sub Classifications
Spraying & Atomising
CPC Codes
Inventors & Applicants
Inventors
Applicants
Helmholtz Zent B Mat & Energ
Patent Abstract
The coating device (01) comprises an atomizing chamber (02), in which a coating solution (03) or coating dispersion is converted into an aerosol by a series of ultrasound sources (05) having an ultrasonic atomizer (04). The flat sheet die (15) forms a width of its outlet port (22) in the area of the width of a substrate (24).
Key Information
Publication No.
DE102009037371B3
Family ID
43571266
Publication Date
2011-03-17
Application No.
DE102009037371A
Application Date
2009-08-13
Priority Date
2009-08-13
Granted
Yes (1/1)
Possible Cooperation
For further information please contact the transfer office.