Single-sided Contact Solar Cell with Plated-Through Holes and Method for Producing It

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The invention describes a single-sided contact solar cell with a unique structure where both electrical contact systems are located on one accessible side of the cell. This design uses plated-through holes in the absorber layer to create conductive paths between layers, simplifying the architecture and fabrication process. The approach is flexible for use with wafer-based or thin-film solar cells, accommodating various configurations while maintaining high efficiency and streamlined manufacturing.

Use CasesContent extracted from patent full text and abstract with AI.

• High-efficiency photovoltaic (PV) modules for rooftop and utility-scale solar installations
• Building-integrated photovoltaics (BIPV) where thin, lightweight, or custom-shaped modules are needed
• Portable solar panels for consumer electronics, vehicles, or off-grid power applications
• Industrial or commercial PV modules requiring cost-effective, high-throughput production processes
• Advanced solar research and prototype development leveraging simplified cell structures

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces fabrication complexity by consolidating both contacts on one side, minimizing processing steps
• Enables high cell efficiency by simplifying current collection and reducing shading losses
• Flexible to both wafer-based and thin-films, widening material and application options
• Supports easier module integration (serial and parallel interconnection) due to accessible contact points
• Allows for use of non-conductive (e.g., glass) substrates, lowering material costs and expanding design possibilities
• Improves reliability and durability, since both contacts are protected and easily accessible for testing and maintenance
• Potential for lower production costs and higher scaling efficiency in PV manufacturing

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Patent Abstract

Known single-sided contact solar cells with through-hole plating of the emitter layer through the absorber layer have contact systems and functional solar cell layers that require complicated insulation and structural steps. The solar cell (HKS) according to the invention has a great many embodiments, always with equal ease of production and high efficiency and can be implemented equally with front- or back-face contacts, wafer- or thin-layer-based, substrate or superstrate configurations and emitter or field passivation wrap-through through-hole plating (DK) through the absorber layer (AS). The contact grid (KG) applied to one side of the absorber layer (AS) is coated on at least the top with a non-conductive electrical insulation layer (IS). This is positioned either between the absorber layer (AS) and the emitter layer (ES) or between the absorber layer (AS) and a field passivation layer (FSF/BSF), each of which is deposited unstructured on its entire surface and in turn is faced with a contact layer (KS). Thus both contact systems (KG, KS) are always located on the top side (OS) of the solar cell (HKS). The other functional layer of the solar cell in each case is through-hole plated through the absorber layer (AS) to the contact grid (KG) by way of point-, line-, lattice- or grid-shaped passage openings (DG).