Method for Performing an Electron Beam Examination of at Least One Specimen and Carrier for Such a Method

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a method for performing electron beam examination (such as transmission electron microscopy) of at least one specimen prepared from a sample. A specially designed carrier is used that initially has a short-circuit bridge spanning a carrier-material-free (open) area. Before examination, this bridge is electrically interrupted to create a precise gap, separating it into two electrically isolated bridge parts. The prepared specimen is then electrically connected across these two bridge parts, and an electron beam is passed through both the specimen and the open area of the carrier for analysis.

Use CasesContent extracted from patent full text and abstract with AI.

• Transmission electron microscopy (TEM) of semiconductor wafer cross-sections during chip manufacturing quality control.
• Failure analysis of microelectronic components where electrical isolation of the specimen on the carrier is critical for accurate imaging.
• Preparation and examination of thin lamella specimens extracted by focused ion beam (FIB) milling from solid-state materials.
• Electron beam analysis of biological or materials-science specimens that require precise electrical grounding or biasing during imaging.
• In-situ electrical measurements combined with electron beam inspection of nanoscale devices on a single carrier platform.

BenefitsContent extracted from patent full text and abstract with AI.

• The short-circuit bridge ensures safe handling and electrostatic discharge protection of the carrier before specimen mounting, reducing the risk of specimen damage.
• Electrical interruption of the bridge creates a well-defined, controllable gap that precisely positions the specimen over the electron-transparent open area.
• Separating the bridge into two electrically isolated parts enables independent electrical contacting of each side of the specimen, supporting in-situ electrical measurements during electron beam examination.
• The carrier-material-free region allows unobstructed transmission of the electron beam through the specimen, improving image quality and analytical accuracy.
• The integrated approach of specimen preparation, mounting, and electrical connection on a single carrier streamlines the workflow compared to conventional multi-step TEM sample preparation methods.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates, among other things, to a method for performing an electron beam examination of at least one specimen (200). According to the invention, it is provided, among other things, that the specimen (200) is produced from a sample (205) by material removal. A short-circuit bridge (120, 120a) bridging a carrier-material-free region (130) of a carrier is electrically interrupted in the region (130) of the short-circuit bridge (120, 120a), whereby a gap (300) is formed between a first bridge part (121) of the short-circuit bridge (120, 120a) and a second bridge part (122) of the short-circuit bridge (120, 120a), and the two bridge parts (121, 122) are electrically separated from each other. The specimen (200) is electrically connected to the bridge parts and an electron beam examination is performed, wherein an electron beam (EB) is directed through the specimen (200) and the carrier-material-free region (130).