Sound Transducer and Method of Manufacturing

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a process for manufacturing sound transducers, specifically capacitive micromachined ultrasonic transducers, using photolithography and wet etching on a glass substrate. The invention details the sequential deposition and processing of various metal and photoresist layers to create precise cavities and electrode structures, resulting in robust and accurate sound transducers suitable for converting electrical energy into acoustic energy (or vice versa). Arrays of such transducers can be produced in parallel, enabling scalable manufacturing for a range of applications.

Use CasesContent extracted from patent full text and abstract with AI.

• Medical ultrasound imaging devices for diagnostics and therapy.
• Industrial non-destructive testing using ultrasonic inspection arrays.
• Automotive parking or collision sensors leveraging ultrasound.
• Gesture recognition systems utilizing ultrasonic sensing.
• Microphone arrays for advanced audio capture or noise cancellation.
• Underwater sonar and communication systems.
• Consumer electronics (e.g., smartphones, tablets) with integrated ultrasonic sensors.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables precise and scalable manufacturing of high-fidelity sound transducers, including ultrasonic devices.
• Improved adhesion and structural integrity during manufacturing thanks to metal layer processing.
• High-precision cavity formation (with sub-micron tolerances) increases transducer accuracy and performance.
• Compatibility with parallel manufacturing processes enables mass production and reduces cost per device.
• Allows for integration with various materials (such as glass and silicon), expanding the range of possible device configurations and applications.
• Versatile method suitable for both emission and sensing of acoustic/ultrasonic signals.

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Patent Abstract

Provided is a process for manufacturing a sound transducer. The process comprises depositing a first metal layer onto a substrate, applying a photo resist layer to the first metal layer, exposing portions of the photo resist layer to electromagnetic radiation, developing the photo resist layer, removing portions of the first metal layer, wet etching portions of the substrate above which the first metal layer has been removed, and depositing a second metal layer onto the substrate.