Method for Reducing the Width of Structures Generated by Ink Deposition on Pre-Patterned Substrates

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a method to create extremely fine, conductive or insulating structures (such as micro- or nano-wires) on surfaces that have been pre-patterned with grooves or channels. By depositing a special ink loaded with nanoparticles into these grooves, capillary forces pull the ink into the channels, and as the solvent evaporates, the particles gather to form narrow lines. Additional processing steps like heating can further shrink the width of these lines, achieving dimensions smaller than conventional ink-based techniques, potentially even below the wavelength of light, and at lower cost compared to advanced lithographic methods.

Use CasesContent extracted from patent full text and abstract with AI.

• Fabrication of micro- and nano-scale wires for flexible or printed electronics on polymer or paper substrates
• Creation of high-resolution electrodes for thin-film transistors (TFTs) in display applications
• Production of wire grid polarizers and optical gratings with metallic or semiconductor nanowires
• Manufacture of transparent conductive electrodes as alternatives to indium tin oxide (ITO) for displays
• Development of biosensor arrays and focusing elements using fine conductive or insulating lines
• Formation of patterns for catalytic surfaces, batteries, and resistive heating elements
• Printing of security features, holograms, or optical devices on paper, films, banknotes, or credit cards
• Microfluidics and open microfluidic systems requiring precise, fine channels or conductive paths

BenefitsContent extracted from patent full text and abstract with AI.

• Enables sub-wavelength or nanoscale patterning using much cheaper and higher-throughput processes than traditional lithography
• Reduces the minimum feature sizes achievable by ink deposition to below the limitations of ink droplet size or printing accuracy
• Allows for both large-area and local application (compatible with techniques like spincoating, inkjet printing, or gravure printing)
• Capillary action and solvent evaporation lead to self-limiting, precise structure formation, minimizing defects and edge roughness
• Supports multiple materials (metals, semiconductors, insulators, organics), and multi-layered devices by sequential ink filling
• Compatible with flexible substrates, making it attractive for wearable and flexible electronics
• Lower processing temperatures possible (below 150°C), suitable for polymers and sensitive substrates
• Potentially enables the fabrication of highly transparent and conductive electrodes for display and optoelectronic devices

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

It is the objective of the present invention to provide a method for reducing the width of structures generated by ink deposition on pre-patterned substrates that enables the generation of fine structure in the sub-wavelength range at low cost and high throughput in order to satisfy the demand for a technology being less expensive than known lithographic processes.This objective is achieved according to the present invention by a method for producing insulating and/or electrically conductive micro- and nano-structures, such as wires or an array thereof, on surfaces having a pre-patterned structure, comprising the steps of:a) providing a substrate having a patterned structure of grooves and/or capillaries;b) self-limiting filling of open grooves and/or capillaries with a functional liquid by capillary action; each wire having a width created by the shape and geometry of the open grooves and/or capillaries; said grooves and/or capillaries having dimensions that they are filled by the functional liquid which is dragged into them by capillary action;c) said grooves and/or capillaries providing lateral confinement of the liquid enabling a separation from neighboring areas and grooves and/or capillaries;d) said functional liquid comprising a solvent or a mixture of solvents and dispersed particles therein; said particles are significantly smaller than the open width of the grooves and/or capillaries;e) said particles cluster together upon evaporation of the solvent resulting in structures of clustered particles, such as lines, along the grooves and/or capillaries.