Silicon Wafer, Method for Structuring a Silicon Wafer, and Solar Cell

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This invention introduces a method for creating an anti-reflective structure on the surface of a {100}-oriented silicon wafer (often used in solar cells) by etching a random distribution of polyhedral (often pyramid-shaped) recesses using a specific chemical solution and flowing conditions. Unlike traditional methods, which require complex masking or photolithography, this process can be performed in a relatively simple and cost-effective way. The surfaces produced absorb light more efficiently, thereby enhancing the performance of solar cells.

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• Production of high-efficiency silicon solar cells with improved light absorption.
• Manufacturing of silicon wafers with anti-reflective surfaces for photovoltaic modules.
• Integration in mass-production lines for photovoltaic wafer/texturing processing.
• Development of silicon-based photodetectors or other optoelectronic devices that benefit from suppressed surface reflections.
• Facilitation of advanced research in light management for silicon micro- and nano-fabrication.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables higher light absorption and conversion efficiency in solar cells due to optimized surface texturing.
• Eliminates the need for complex, expensive photolithography or masking steps, reducing manufacturing costs.
• Process is compatible with standard industrial etching equipment and can be easily scaled for mass production.
• Works at relatively low temperatures (room temperature), saving energy costs and simplifying processing.
• Allows the use of monocrystalline and quasi-monocrystalline {100} oriented silicon, supporting flexible material choice.
• Produces dense and randomly distributed microstructures that minimize reflection, improving energy yield from sunlight.
• Offers controlled process parameters (etching solution composition, flow, temperature) for reproducible and optimized results.

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Inventors & Applicants

Patent Abstract

According to various embodiments, a silicon wafer (202) is provided, which has a 100-oriented surface (202a), wherein the surface (202a) has a surface structure (204) of a plurality of randomly distributed recesses, said recesses having a polyhedral shape.