Method and System for Separating Components of Solder-Containing Assemblies

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This invention presents a method and system for selectively separating components of solder-containing assemblies, such as printed circuit boards (PCBs), by using specific iron-oxidizing microorganisms to convert Fe(II) to Fe(III), which then leaches the solder and detaches electronic components. The process includes bioreactors for cultivating the microorganisms and for leaching (optionally assisted by ultrasound), allowing efficient and environmentally friendly recovery of valuable metals and components without extensive mechanical shredding or harsh chemicals.

Use CasesContent extracted from patent full text and abstract with AI.

• Recycling of electronic waste (e-waste), specifically printed circuit boards and similar soldered electronic assemblies
• Recovery of valuable metals (e.g., gold, silver, copper, tin, rare earth elements, platinum group metals) from e-waste
• Separation and recovery of reusable electronic components before further material processing
• Processing and recycling of photovoltaic modules and other soldered electronic panels
• Industrial-scale dismantling and material recovery operations for e-waste management

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces chemical consumption and environmental impact compared to conventional chemical or thermal recycling methods
• Minimizes the need for energy-intensive mechanical pre-treatment (like shredding or high-temperature melting)
• Decreases losses of fine or rare valuable elements, increasing recovery rates
• Selective removal of solder enables easier, purer separation of valuable electronic components and base boards
• Mitigates formation of toxic gases (e.g., dioxins/furans) often released during conventional thermal methods
• Enables process automation and scalability for industrial use
• Overall, promotes more sustainable and economical e-waste recycling

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Patent Abstract

The invention relates to a method for separating the components of assemblies containing solder by oxidizing Fe(II) to Fe(III) by means of at least one Fe(II)-oxidizing microorganism and by at least partially leaching solder, wherein Fe(III) is at least partially reduced to Fe(II). The invention also relates to a system and to the use of said system for separating the components of assemblies containing solder.