Method and Device for Cutting Workpieces Made of Hard Brittle Materials

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This patent describes a method and device for cutting workpieces made of hard and brittle materials, such as silicon, by using a wire that moves translationally while the workpiece moves towards it. The key innovation is to superimpose the usual feed movement of the workpiece with one or more oscillatory (vibrational) movements in up to six degrees of freedom, with carefully controlled frequency and amplitude. This results in improved cutting performance, especially in terms of surface quality, cutting force, and productivity.

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• Manufacturing of silicon wafers for the semiconductor industry
• Production of solar cells from monocrystalline or polycrystalline silicon blocks
• Precision slicing of other hard and brittle materials like ceramics or sapphire
• Cutting glass substrates for electronics or displays
• Processing artificial gemstones or hard stone for industrial uses

BenefitsContent extracted from patent full text and abstract with AI.

• Improved surface quality on both entry and exit sides of the workpiece
• Reduced required cutting force and lower power consumption
• Better control over wafer thickness and parallelism, resulting in more uniform products
• Possibility to increase feed speed, thereby raising productivity
• Reduced wear on cutting wires and abrasive particles, lowering operating costs
• Enhanced process control with adaptable frequencies and amplitudes based on specific needs

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Patent Abstract

Die Erfindung betrifft ein Verfahren zum Trennen von Werkstücken aus sprödharten Werkstoffen, bei dem ein Werkstück mit einer translatorischen Vorschubbewegung senkrecht auf einen senkrecht dazu ausgerichteten und mit einer Vorschubgeschwindigkeit bewegten Draht zu bewegt wird. Die Vorschubbewegung des Werkstücks wird mit einer Schwingungsbewegung überlagert und dabei die Schwingungsbewegung, die mindestens einen und bis zu sechs Freiheitsgrade aufweist, mit einer Frequenz im Bereich 20 Hz bis 30 kHz durchgeführt wird