Printable Paste, Method for Its Preparation, and Method for Equipping a Substrate with an Electrically Conductive Structure

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This invention describes a printable paste that allows for the creation of electrically conductive structures on substrates. The paste can be applied using screen or stencil printing techniques. It is particularly suitable for use on substrates with an ultra-low glass transition temperature (Tg), making it ideal for delicate or heat-sensitive materials.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing flexible printed electronic circuits on plastic films
• Creating conductive traces on wearable technology fabrics
• Producing low-temperature electronic devices or sensors
• Printing antennas or RFID tags on various substrates
• Repairing or prototyping printed circuit boards (PCBs) without high-temperature processes

BenefitsContent extracted from patent full text and abstract with AI.

• Enables production of electrically conductive patterns at lower temperatures, preserving sensitive substrates
• Compatible with common printing methods like screen and stencil printing for scalable manufacturing
• Allows use of flexible, ultra-low Tg materials in electronics, expanding design possibilities
• Reduces energy consumption and risk of thermal damage during manufacturing
• Facilitates rapid, cost-effective prototyping and repair of electronic components

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Patent Abstract

Die vorliegende Erfindung betrifft eine druckbare Paste, mit der die Bereitstellung elektrisch leitfähiger Strukturen möglich ist. Die druckbare Paste ist insbesondere mittels Siebe- oder Schablonendruck aufbringbar und eignet sich insbesondere für Substrate mit ultraniedrigem Tg