Optoelectronic Component

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This invention describes an optoelectronic component integrating an optical waveguide and at least one electro-optical component (such as a modulator or photodetector) monolithically into a semiconductor chip. It features a novel arrangement where the optical and electrical connections are separated onto different sides of the chip, with electrical connections routed from the electro-optical device through vias in the substrate to the underside, offering improved efficiency and compact integration. The design facilitates simpler, lower-loss coupling between optical fibers and photonic circuits, as well as optimized electrical interfacing.

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• Optical transceiver modules for high-speed data communication networks (e.g., data centers, telecom switches).
• Integration into photonic integrated circuits (PICs) for on-board optical interconnects in computers and servers.
• Miniaturized optoelectronic sensors for biomedical or industrial applications.
• Advanced fiber optic communication components requiring compactness and scalability.
• Devices in telecommunications infrastructure where efficient fiber-to-chip coupling is needed.

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces optical and electrical losses by minimizing transition points and optimally routing connections.
• Enables a compact and scalable package with clear separation of optical and electrical interfaces, simplifying assembly and scaling to higher data rates.
• Facilitates the use of standard, cost-effective silicon-on-insulator (SOI) fabrication, lowering manufacturing costs.
• Supports monolithic integration of both optical (modulators/photodetectors) and electronic (amplifiers/drivers) components, enabling higher performance and reliability.
• Improves end-to-end signal quality by minimizing insertion and coupling losses, essential for high-performance optical communication.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to an optoelectronic component (100) comprising a chip (110) with a substrate (12) and at least one optical waveguide (20) integrated in the chip (110). According to a variant of the invention, an electro-optical component (30) is monolithically integrated into one or more semiconductor layers of the chip (110) which is arranged on the upper side (12a) of the substrate (12), or on the upper side (12a) of the substrate (12), and at least one electrical connection of the monolithically integrated electro-optical component (30) is connected by means of a connecting line (41) to a conductor connection (43) which is arranged below the lower side of the substrate (12b). The connection line (41) extends through a through hole (42) in the substrate (12) from the electro-optical component (30) to the conductor connection (43) arranged on the lower side of the substrate (12b).