Thick-wire Bond Arrangement and Method for Producing

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This invention describes an improved thick-wire bond arrangement and the method for producing it, specifically for high-current applications such as power semiconductors. The key advance is a specially shaped end section of the thick wire bond—the wire is tapered toward its end, and this shaped section is bonded to a substrate. This geometric modification reduces mechanical stress (shear forces) in the bond area, improving the reliability and lifespan of the electrical connection, particularly by reducing the likelihood of fatigue cracks at the interface between the wire and substrate.

Use CasesContent extracted from patent full text and abstract with AI.

• Power semiconductor modules for electric vehicles, renewable energy systems, and industrial drives
• LED modules and high-power lighting systems
• High-power electronic switching circuits
• Sensors and microelectromechanical systems (MEMS) requiring robust high-current interconnections
• Integrated circuit (IC) chip packaging for devices that operate under high currents and high temperatures

BenefitsContent extracted from patent full text and abstract with AI.

• Greatly improves the mechanical reliability of thick-wire bonds by reducing stress concentration at the bonded area
• Minimizes the risk of fatigue cracks and failure in high-current or thermally cycled environments
• Maintains electrical performance and current-carrying capacity
• Can be integrated into existing thick-wire bonding processes without significant equipment changes
• Applicable to a wide range of wire and substrate materials, enhancing its industrial flexibility

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a thick-wire bond arrangement, having a substrate (2), a thick wire (1) and a high-voltage thick-wire bond connection, where an end bond section (4) of the thick wire (1), which extends towards the end (7) of the thick wire (1), is bonded to the substrate (2), such that a bond contact (5) between the thick wire (1) and the substrate (2) is formed in the region of the bond section (4), the thick wire (1) having a tapering section (6) which adjoins the end (7) of the wire and in which the cross-section of the wire tapers towards the end (7) of the wire. The application further relates to a method for producing a thick-wire bond arrangement.