Solder Material, Method for the Production Thereof, and Use Thereof to Join Metal Substrates without Pressure

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a silver-based solder material—available as a paste or compacted powder—that can join metal or metallized substrates, especially copper, without applying pressure and at relatively low temperatures (150–250°C). Its composition uses a metal-organic silver complex precursor that creates silver nanoparticles and a silver-metal molten phase upon heating. This approach allows strong, homogeneous, and reliable joints to be formed, suitable for sensitive electronic and electrical applications that require lead-free, high-performance soldering.

Use CasesContent extracted from patent full text and abstract with AI.

• Soldering and joining of copper components in electronics and microelectronics assembly.
• Manufacturing of high-power electronic devices where excellent thermal and electrical conductivity are crucial.
• Soldering applications where substrates are sensitive to high temperatures or pressure (e.g., delicate microchips, sensors).
• Use in the automotive and aerospace industries for reliable, lead-free electrical connections.
• Assembly of multilayer printed circuit boards (PCBs) and advanced packaging technologies.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables strong, reliable joints without the need for external pressure during assembly.
• Operates at significantly lower temperatures than traditional silver soldering (starting from 150°C), which protects temperature-sensitive components.
• No need for lead, making the solder material RoHS-compliant and environmentally friendly.
• Produces dense, homogeneous silver layers with excellent electrical and thermal conductivities.
• Improved reliability under thermal cycling compared to conventional solders, reducing failure risk in demanding electronics applications.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a silver solder paste and to a silver solder paste containing copper, which can be used to join metal or metallized substrates, in particular copper substrates, without pressure at low temperatures. The silver solder according to the invention contains metal-organic silver complex as a precursor, which forms silver nanoparticles only upon being heated and which forms a silver-metal molten phase over a temperature range from 20 to 40 units upon being heated further, which silver-metal molten phase can be used as a process window for joining already starting at 150°C, preferably starting at approximately 200°C.