Method for Producing an Electronic System, Method for Producing a Free-Form Surface with Such a System, and Electronic System and Free-Form Surfaces with Such a System

Publication: DE102009031568A1
Published: 2010-12-30
Family Size: 6
Granted: Yes (2/6)

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a method and system for producing stretchable (elastic) electronic assemblies that can be securely and easily attached to arbitrarily shaped (freeform) surfaces, including flexible, curved, or rigid substrates. The system consists of an elastic substrate with a fan-out contact structure, onto which electronic components are mounted and encapsulated with a stretchable material. The resulting device retains high flexibility and does not significantly impair the deformation or comfort of the underlying surface (such as textiles), while allowing robust electrical connectivity and simple attachment methods like bonding, laminating, stitching, or heating.

Use CasesContent extracted from patent full text and abstract with AI.

  • Wearable electronics integrated into clothing, such as health monitoring sensors or smart textiles.
  • Attaching electronic modules (sensors, lights, communication devices) to medical bandages or patches that must conform to the body.
  • Integrating electronic sensors into sports equipment, soft robots, or curved industrial surfaces for monitoring and control.
  • Smart packaging or labels that require electronics to fit irregular product shapes.
  • Adding electronic functions to automotive interiors with complex or curved surfaces.
  • Flexible e-signage or advertising displays that must bend or wrap onto diverse surfaces.

BenefitsContent extracted from patent full text and abstract with AI.

  • Highly flexible and stretchable electronics that maintain the underlying material's properties, such as comfort and deformability, especially for textiles.
  • Enables electronics to be mounted on surfaces with complex or multi-dimensional curves, unlike previous rigid or only singly-curved systems.
  • Encapsulation and design options make the systems durable, washable, and resistant to mechanical stresses, expanding their use in wearables and demanding applications.
  • Simple, user-friendly attachment methods like self-adhesive mounting, ironing, stitching, or laminating increase versatility and ease of deployment.
  • Allows for modularity and personalization of electronic systems (e.g., users can select and apply their own modules to garments or surfaces of choice).
  • Reliable electrical contacts and robust connections, even in stretchable or harsh environments.

Technical Classifications (CPCs)

Main Classifications

Electrical & Electronic Tech

Sub Classifications

Electric Techniques (Other)

CPC Codes

H05K1/0283H05K1/038H05K1/189

Inventors & Applicants

Applicants

Fraunhofer Ges Forschung

Univ Berlin Tech

Patent Abstract

The invention relates to a method for generating an electronic system for application to freeform surfaces, a method for producing freeform surfaces having an electronic system, and an electronic system and a combination of a freeform surface having at least one such system. According to the invention, an elastic interconnect device having an elastic substrate and an elastic, fanned-out contact structure with contact surfaces comprised of conductor lines is generated first. Then, electronic components are mounted on the interconnect device. Finally, the interconnect device is encapsulated. If a freeform surface with an electronic system is to be generated, the electronic system produced in this way is then mounted on the previously provided freeform surface.

Key Information

Publication No.

DE102009031568A1

Family ID

42716432

Publication Date

2010-12-30

Application No.

DE102009031568A

Application Date

2009-06-29

Priority Date

2009-06-29

Granted

Yes (2/6)

Possible Cooperation

For further information please contact the transfer office.