Method for Producing Mechanical Stops for Self-Adjustment and Device with Stops for Self-Adjustment

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a method for producing mechanical alignment stops that enable highly precise self-alignment (self-justage) of two substrates—such as chips or optical components—during assembly. The process uses a combination of dry and anisotropic etching to create vertical and horizontal alignment structures in a substrate, deposits contacts made of fusible material (like solder), and brings a second substrate with matching contacts into position. Upon remelting the solder, the substrates self-align due to surface tension forces minimizing interface energy, and are locked into precise relative positions by the mechanical stops.

Use CasesContent extracted from patent full text and abstract with AI.

• Mass production of optoelectronic assemblies such as photonic, laser, or fiber optic modules requiring sub-micrometer alignment accuracy.
• Passive alignment and assembly of optical fibers, waveguides, or chips in silicon photonics and integrated optics.
• Manufacturing of precision sensors or MEMS devices where tight alignment tolerances are necessary.
• Flip-chip bonding processes for electrical and optical device integration without costly active alignment steps.
• Assembly of VCSELs (Vertical-Cavity Surface-Emitting Lasers), photodiodes, modulators, and similar components on substrates.

BenefitsContent extracted from patent full text and abstract with AI.

• Achieves high-precision alignment (down to 1 μm or better) between components without active adjustment.
• Reduces production steps and cost, enabling scalable mass manufacturing.
• Minimizes alignment time and potential human error, increasing yield and reliability.
• Combines mechanical and surface tension alignment for robust final positioning of parts.
• Allows simultaneous fabrication of alignment features and optical/electronic elements, improving consistency and integration.
• Can be applied to a variety of substrates/materials, especially common ones like silicon, enabling broad applicability in microfabrication.

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Inventors & Applicants

Patent Abstract

The present invention relates to a method for producing mechanical stops for self-alignment, and to a device comprising stops for self-alignment. The method comprises dry etching and anisotropic etching of a first substrate (1) in order to produce at least one horizontal stop (8) and at least one vertical stop (4). At least one contact (3) composed of fusible material is deposited on the structured first substrate (1) and remelted. A second substrate (2) having at least one second contact composed of a material that can be connected to the fusible material of the first contact (3) is positioned on the first contact. Self-alignment of the two substrates (1, 2) subsequently takes place by virtue of the at least one remelted contact (3) being established in such a way that the interface energy is minimized.