Photonically Integrated Chip, Optical Component with Photonically Integrated Chip, and Method for Their Manufacture

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This invention describes a photonic integrated chip (PIC) that incorporates an optical structure for enhanced beam shaping directly into its layers. The chip integrates a waveguide and a grating coupler with one or multiple refractive and diffractive structures, such as lenses or beam splitters, situated above or below the coupler. These structures help to shape the light beam before it enters or after it leaves the waveguide, allowing more efficient and scalable coupling of light between the chip and external components (such as fibers, lasers, or photodetectors), without the need for external micro-optics or complex alignment.

Use CasesContent extracted from patent full text and abstract with AI.

• Optical data communication systems for coupling light efficiently between photonic chips and optical fibers.
• Miniaturized photonic sensors and biosensors integrating sources and detectors.
• Integration of on-chip light sources (like VCSELs or lasers) with photonic waveguides for communications or sensing.
• Efficient interconnection between different photonic chips in an optoelectronic system.
• Photonic computing or signal processing modules requiring high-density optical input/output coupling.

BenefitsContent extracted from patent full text and abstract with AI.

• Significantly reduced optical coupling losses and improved efficiency for light entering or exiting the chip.
• Elimination of external optical components (like lenses or fibers), saving space and cost.
• Higher alignment precision since the diffractive/refractive elements are fabricated lithographically and precisely aligned during chip manufacturing.
• Simpler, more scalable manufacturing and packaging processes suitable for mass production.
• Smaller device footprint and higher integration density compared to traditional coupling methods.
• Enables coupling to a greater variety of optical sources and detectors (including highly divergent or convergent beams).

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and effects beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or effects beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s). With respect to the chip, the invention provides for an optical diffraction and refraction structure (100, 100a) which carries out beam forming of the radiation before being coupled into the waveguide or after being coupled out of the waveguide to be integrated in a material layer of the chip (2) above or below the optical grating coupler (60) or in a plurality of material layers above or below the optical grating coupler (60) or on the rear side of the substrate (20).