Method for Producing an Arrangement

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This patent describes a method for creating an arrangement of electronic components by stacking at least two carriers (such as circuit boards), each with its own electronic component. The carriers are joined using an adhesive that contains electrically conductive particles, creating an anisotropically conductive adhesive layer. This layer provides both mechanical attachment and electrical connections only in the direction perpendicular to the adhesive layer, allowing electrical contacts on each carrier to connect vertically while maintaining electrical isolation in other directions. The invention is especially useful for embedding and connecting very thin electronic components in compact, multi-layered assemblies.

Use CasesContent extracted from patent full text and abstract with AI.

• Advanced 3D packaging for integrated circuits and semiconductors
• Stacking and connecting multiple electronic modules within compact consumer devices (e.g., smartphones, digital cameras, gaming consoles)
• Miniaturized medical devices and electronic implants
• Multilayer printed circuit board (PCB) or flexible PCB manufacturing
• Electric vehicle or aerospace electronics where high-density, lightweight integration is needed
• Smart cards or memory card modules requiring high component density

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces device size and weight by enabling vertical (3D) integration of components
• Simplifies manufacturing, as both mechanical joining and electrical connection happen in a single step
• Allows reliable electrical connections only where contacts are vertically aligned, minimizing risk of electrical shorts between neighboring contacts
• No need for complex alignment or expensive equipment; the conductive particles maintain the correct spacing and electrically connect only the intended areas
• Facilitates encapsulation of sensitive components during the adhesive process, improving protection and reliability
• Supports use of very thin or ultrathin semiconductor chips and substrates, increasing flexibility in design and enabling further miniaturization
• Adaptable for both rigid and flexible electronics, broadening the range of possible products
• Potentially lowers production cost through equipment savings and process consolidation

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates inter alia to a method for producing an arrangement, in which (a) a first electrical component (60) is arranged on a first carrier (10), (b) a second electrical component (260) is arranged on a second carrier (200) and (c) the two carriers are connected to one another, wherein the sequence of steps (a) to (c) is arbitrary. According to the invention, the two carriers are adhesively bonded to one another with an adhesive (310) containing electrically conductive particles (300) so as to form an anisotropically conductive adhesive layer (320), wherein the adhesive layer is used to produce an electrical connection between at least one electrical contact surface (80) on the first carrier and at least one electrical contact surface (240) on the second carrier.