Method for Manufacturing an Electronic Assembly and Electronic Assembly

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a manufacturing method for producing electronic modules where at least one electronic component is at least partially embedded in an insulating material. The process involves creating specific holes in a conductive layer to accommodate bumps (contact points) from the electronic component, attaching the component using an adhesive, embedding it into a dielectric layer, and subsequently exposing the bumps to create efficient electrical connections using metallization and structured conductor tracks. The resulting structure allows for finer connection grids and simplifies certain manufacturing steps compared to conventional approaches.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing advanced multilayer printed circuit boards (PCBs) with embedded semiconductors.
• Producing highly miniaturized electronic devices where space savings are critical.
• Developing sensors or microelectronic devices with improved reliability due to better contact and embedding techniques.
• Applications in mobile phones, wearables, medical devices, and automotive electronics requiring compact and reliable modules.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables higher miniaturization and finer pitch for embedded electronic components, supporting advanced compact designs.
• Simplifies the manufacturing process by eliminating the need for traditional via drilling, reducing steps and potential errors.
• Reduces the overall thickness of the electronic assembly, making devices slimmer.
• Improves alignment accuracy and reliability of electrical contacts.
• Lowers production costs due to process simplification and fewer alignment constraints.
• Enhances mechanical stability and protection of embedded components.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a method for producing an electronic unit, wherein at least one electronic component is at least partially embedded in an insulating material, comprising the following steps: providing a film assembly with at least one conductive layer and a carrier layer, or with only a conductive layer, structuring the conductive layer such that openings in form of blind holes or through holes for receiving bumps are produced, which are connected to the contact surfaces of the at least one electronic component, applying an adhesive layer to the conductive layer provided with openings, placing the at least one component on the film assembly, or in the conductive layer, such that the bumps engage with the openings of the conductive layer, partially embedding the at least one component from the side opposite of the bumps (3) into a dielectric layer, removing the carrier layer of the film assembly, or a part of the conductive layer, such that the surface of the bumps is exposed, depositing a metallization layer on the side of the remaining conductive layer having the exposed bumps, and structuring the metallization layer and the conductive layer so as to produce conductor tracks that overlap with the bumps. The invention further relates to an electronic unit produced by such a method.