Modular Microelectronic Component

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This invention describes a modular microelectronic component composed of multiple functional layers, each containing electronic components, conductors, and contact points positioned at the edges. These layers are stacked and electrically connected via these edge contacts, enabling the manufacturing of very compact, robust microelectronic modules. The method accommodates varying component sizes and types within each layer, offers improved manufacturing flexibility, and reduces development complexity and integration issues compared to conventional approaches.

Use CasesContent extracted from patent full text and abstract with AI.

• High-density sensor or processor modules for small electronic devices
• Wireless sensor nodes in condition monitoring (e.g., for remote or rotating parts)
• Wearable electronics and medical implants requiring miniaturized robust assemblies
• Embedded systems with modular upgrades or application-specific configurations
• Custom IoT (Internet of Things) modules for environmental sensing, motion tracking, or asset management
• Industrial automation components needing space-saving and rugged microelectronics
• Harsh environment electronics (e.g., inside tires, engines, or machinery)
• Prototyping and rapid development of complex microelectronic systems

BenefitsContent extracted from patent full text and abstract with AI.

• Significantly reduces the size and volume of complex electronic assemblies
• Improves mechanical robustness, suitable for harsh operational environments
• Allows flexible design and easy modular integration of different electronic functions
• Enables use of various substrates and construction materials tailored to specific needs (e.g., temperature, mechanical, or electrical performance)
• Minimizes wiring and interconnection complexity through edge contact points
• Supports easy testing and functional verification of individual layers before final assembly
• Facilitates rapid prototyping and customization, lowering time and cost for new designs
• Enables higher reliability due to reduced number of internal connections and increased protection from environmental hazards

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a modular microelectronic component and a method for the production thereof. The inventive method comprises the following steps: a) at least two functional layers (12, 22) are produced, each of which is provided with a planar support (10, 20), electronic components, 1 to 5, 8, 9) located on the support (10, 20), a conductor structure, and electrical first contact points (11, 21) located on the edge (6, 23) of the support (10, 20). The conductor structure contacts the electronic components at least in part while being at least partly connected to the first contact points (11, 21) on the edge (6, 23) of the support (10, 20); b) the functional layers (12, 22) are placed on top of each other layer by layer; c) the functional layers (12, 22) are electrically connected via the first contact points (11, 21). The invention makes it possible to produce an extremely compact and robust microelectronic component while the adjusting effort can be kept very low compared to other modular methods when designing the individual functional layers. Very different aspect ratios of the individual functional layers are rather unproblematic during system integration, resulting in a small amount of development effort.