Method and Device for Controlling the Generation of Ultrasonic Wire Bonds

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a method and device for producing ultrasonic wire bonds, typically used to connect microchip pads and substrates. The novel aspect is a system that simultaneously measures both the vibration amplitude and the deformation of the wire during the ultrasonic bonding process, and then combines these measurements into a single signal that directly indicates bond stability. Using this real-time information, the system can dynamically adjust bonding parameters (such as ultrasonic energy and applied force) to optimize bond quality as each bond is being formed.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of microchips and integrated circuits where wire bonding is required for electrical connections.
• Production of semiconductor devices, particularly in connecting chips to their packages or substrates.
• Quality control systems in advanced wire bonding machines for electronics assembly.
• Repair and remanufacture of faulty wire bonds by automatically detecting suboptimal bonds during production.
• Bonding processes involving delicate microelectronics, MEMS, or sensors where precise bond strength is critical.

BenefitsContent extracted from patent full text and abstract with AI.

• Provides real-time, direct measurement of bond stability, enabling immediate adjustments and reducing defective bonds.
• Combining deformation and vibration amplitude into a single signal simplifies data analysis and process control.
• Improved bond quality and yield due to dynamic, in-situ parameter optimization.
• Automatic detection and marking of weak or faulty bonds for further inspection or repair.
• Reduces the need for post-process inspection or destructive bond testing, thus saving time and resources.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a method for generating a wire bond between a wire (3) and an electrical contact member (4), the method comprising the steps of: pressing a first surface (A(t)) of a portion (3a) of the wire (3) against a second surface (S) of the electrical contact member (4) with a first force (Fnb) normal to the second surface while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude (a(t)) of the portion (3a) of the wire (3) at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation (z(t)) of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal (Fs(t)) from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step. The invention also relates to a device for generating this kind of bonds, wherein an analysing device (9) is provided that is adapted to generate a time dependent first signal (Fs(t)) from at least said vibration amplitude and said deformation of the wire at a number of discrete time steps during generation of the bond, wherein said first signal is a direct measure of the stability of the bond at the respective time step.