Sensor Unit
Simple SummaryContent extracted from patent full text and abstract with AI.
This invention describes a sensor unit designed for the precise measurement of variables (such as pressure or temperature) in aggressive liquid or gaseous environments. The sensor combines a robust, miniaturizable construction with improved resistance to harsh media and mechanical stress. Key features include a sensor capsule with a measurement opening, a sensor region with measurement electronics, and an innovative through-hole (plated-through hole) in the base, which electrically connects the front-facing measurement electronics to supply lines at the rear, allowing for more compact, reliable, and vibration-resistant assembly. The design omits fragile wire bonds, avoids unwanted signal interference, and is suitable for high-temperature conditions.
Use CasesContent extracted from patent full text and abstract with AI.
- Monitoring pressure or temperature in automotive engines (e.g., oil pressure sensors in combustion engines).
- Measuring pressure or temperature in turbines, especially gas turbines operating at high temperatures.
- Hydraulic and pneumatic tools that require robust sensors in chemically or mechanically aggressive fluids.
- Industrial process control in chemical plants or refineries, where sensors face harsh environments.
- Precision climate control systems needing reliable, contamination-resistant pressure or temperature sensors.
- Differential pressure monitoring (for example in HVAC or filter systems) using reference channels.
BenefitsContent extracted from patent full text and abstract with AI.
- Highly resistant to aggressive chemicals, contaminants, and high temperatures, increasing sensor durability.
- Miniaturized design enables use in space-limited environments and supports batch manufacturing (lowering costs).
- No fragile wire bonds—reduces failure risk due to vibration or mechanical stresses (increases reliability).
- Improved measurement accuracy by decoupling from external mechanical/thermal influences.
- Allows for direct exposure of only inert silicon to harsh media, minimizing risk of corrosion or signal interference.
- Compatible with established semiconductor techniques (e.g., SOI technology), supporting scalability and customization.
- Versatile for both absolute and relative (differential) pressure measurements, including ability to withstand aggressive reference media.
Technical Classifications (CPCs)
Main Classifications
Physics & Measurement
Sub Classifications
Measuring & Testing
CPC Codes
Inventors & Applicants
Inventors
Applicants
Kistler Holding Ag
Univ Berlin Tech
Obermeier Ernst
Mukhopadhyay Biswajit
Von Berg Jochen
Albicker Ulrich
Gnielka Marco
Cavalloni Claudio
Patent Abstract
The invention relates to a sensor unit for measuring a measurement variable in a medium (2), in particular in an aggressive liquid or gaseous medium (2), said unit comprising a sensor (4) which is arranged in a sensor capsule (3) and has a sensor region (6) which is arranged on a base body (5), wherein, in order to detect the measurement variable in the sensor region (6), a measurement opening (7) is provided in the sensor capsule (3). On a side facing the measurement opening (7), the sensor region (6) has a measurement surface (9) which is provided with measurement electronics (8), wherein an electrical supply line (10) is provided on the sensor (4) for the purpose of transmitting a sensor signal which is generated by the measurement electronics (8). According to the invention, a plated-through hole (11) is provided in the base body (5), which plated-through hole is used to connect the measurement electronics (8) to the electrical supply line (10) via signals through the base body (5), on a base side (12) of the sensor (4) which faces away from the measurement opening (7).
Key Information
Publication No.
WO2008025182A2
Family ID
38006624
Publication Date
2008-03-06
Application No.
CH2007000421W
Application Date
2007-08-28
Priority Date
2006-08-30
Granted
Yes (1/6)
Possible Cooperation
For further information please contact the transfer office.