Method for Determining a Bond Connection in a Component Assembly and Testing Device

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a method and apparatus for testing the quality of wire bond connections in electronic component assemblies. The method involves creating a structure (such as grooves or marks) on the top surface of a bonding wire at the bonded section, applying a test voltage to heat the bond via current flow, and generating a thermal image (thermogram) of the heated bond. By analyzing the thermogram, it is possible to determine whether the bond has been correctly produced without damaging the component.

Use CasesContent extracted from patent full text and abstract with AI.

• Quality control in semiconductor manufacturing for wire-bonded connections.
• Automated inspection systems in electronics assembly lines.
• Preventive maintenance and reliability testing for power electronics with thick wire bonds.
• Real-time or online diagnosis of bond quality in high-volume production environments.
• Failure analysis in electronic device manufacturing.

BenefitsContent extracted from patent full text and abstract with AI.

• Non-destructive testing of bond connections, preserving device integrity.
• Increased reliability and consistency in detecting faulty or weak wire bonds.
• Potential for automation and integration into smart manufacturing systems (Industry 4.0).
• Improved production yields by early detection of substandard bonds.
• Provides detailed and high-resolution thermal analysis, enabling precise localization of defects.
• Facilitates ongoing quality monitoring with online or remote diagnosis capabilities.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The application relates to a method for determining a bonding connection (1) in a component arrangement (2), wherein the method has the following steps: producing a bonding connection (1) between a bonding section (3) of a bonding wire (4) and a metallic contact point (5), structuring a top-side surface of the bonding wire (4) in the region of the bonding section (3) and determining the bonding connection (1), wherein in this case a test voltage is applied to the bonding wire (4) and the bonding connection (1) so that the bonding connection (1) heats up owing to the current flow, generating a thermogram for the heated bonding connection (1) and determining whether the bonding connection (1) has been produced correctly by evaluating the thermogram. Furthermore, the application relates to a test apparatus for determining a bonding connection (1) in a component arrangement (2).