Method for electrical contacting during application of electronic components on substrate, involves holding electronic components with associated contact areas on support material

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a method for electrically connecting electronic components to a substrate by holding the components with their contact areas on a support material. The support material brings the components onto the substrate, where they are pressed into place, facilitating precise electrical contacting. The invention also includes a device to perform this method.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of smart cards where chips must be affixed to card substrates
• Production of RFID tags on flexible substrates for logistics, retail, or security
• Automated assembly of printed circuit boards (PCBs) with small or delicate electronic components
• Fabrication of flexible electronics, such as wearable devices or electronic labels

BenefitsContent extracted from patent full text and abstract with AI.

• Improves precision and reliability in attaching electronic components to substrates
• Reduces manual handling, lowering the risk of component damage
• Allows for high-speed, automated mass production
• Enhances the electrical connection quality of mounted components
• Enables efficient production of compact or flexible electronic devices

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The method involves holding electronic components with associated contact areas on support material. The support material is supplied to a substrate, where the electronic components are guided under pressure to run electronic components on substrate conveyor. An independent claim is included for a device for execution of electrical contacting method.