Mounting Electronic Components onto Substrates with Reliable Electrical Contact

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a method for electrically connecting electronic components to a substrate by holding the components with their contact areas on a support material. The support material brings the components onto the substrate, where they are pressed into place, facilitating precise electrical contacting. The invention also includes a device to perform this method.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of smart cards where chips must be affixed to card substrates
• Production of RFID tags on flexible substrates for logistics, retail, or security
• Automated assembly of printed circuit boards (PCBs) with small or delicate electronic components
• Fabrication of flexible electronics, such as wearable devices or electronic labels

BenefitsContent extracted from patent full text and abstract with AI.

• Improves precision and reliability in attaching electronic components to substrates
• Reduces manual handling, lowering the risk of component damage
• Allows for high-speed, automated mass production
• Enhances the electrical connection quality of mounted components
• Enables efficient production of compact or flexible electronic devices

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The method involves holding electronic components with associated contact areas on support material. The support material is supplied to a substrate, where the electronic components are guided under pressure to run electronic components on substrate conveyor. An independent claim is included for a device for execution of electrical contacting method.