Modular Micromechanical Ultrasound Transducer with Scalable Cell-Based Design

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This patent describes a method for producing a micromachined ultrasonic transducer (MUT) using modular base cells arranged in a grid on a substrate. Each base cell contains an electrode and an electromechanical transducer element. The process allows for flexible separation of chips from the substrate along custom-defined lines and for post-process electrical interconnection or separation of these base cells. This approach enables the modular and customizable assembly of ultrasonic transducers in various sizes, shapes, and channel configurations, accommodating diverse application requirements without the need for expensive or time-consuming re-designs.

Use CasesContent extracted from patent full text and abstract with AI.

• Medical imaging equipment (e.g., ultrasound scanners)
• Non-destructive testing and evaluation (NDT) of materials or structures
• Industrial process monitoring using ultrasound sensors
• Optoacoustic and photoacoustic imaging in biological or medical research
• Miniaturized or custom-shaped ultrasonic sensors for robotics or automation
• Environmental or fluid flow monitoring with embedded sensors
• Wearable health monitoring devices using ultrasonic sensing
• Point-of-care diagnostic tools requiring customized transducers

BenefitsContent extracted from patent full text and abstract with AI.

• Highly modular and customizable ultrasonic transducer production
• Reduced manufacturing costs and time, especially for small and medium batch sizes
• No need for new photolithographic masks or entire process re-designs for custom chip geometries
• Fast development and delivery of application-specific ultrasonic transducer components
• 'Off the shelf' availability of base modules that can be quickly adapted to customer needs
• Enables rapid prototyping and scaling for diverse or unique end-use scenarios
• Greater accessibility of advanced MUT technology to SMEs and niche markets
• Ability to define electrical connections post-fabrication adds flexibility to system design

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Inventors & Applicants

Patent Abstract

The invention relates to a method for manufacturing a micromechanical ultrasonic transducer and an ultrasonic transducer. The micromechanical ultrasonic transducer is formed from a plurality of modular base cells (1) on a substrate (2) in microtechnology manufacturing by thin-film deposition and lithographic processes, wherein a plurality of base cells (1) are arranged in a grid pattern on a substrate (2) and each base cell (1) has at least one electrode (3) and at least one electromechanical transducer element (4), and wherein a group of base cells (1) forms a chip (15), the chip (15) being separated from the substrate (2) by separation along at least one freely definable singulation line (8), and - that base cells (1) arranged adjacent to one another are first contacted with one another by means of an electrical contact (6) after the microtechnology manufacturing, or - that the base cells arranged adjacent to one another were electrically connected to one another in the microtechnology manufacturing via a contact area (7) and their electrical connection is separated after the microtechnology manufacturing by separation of the contact area (7). The micromechanical ultrasonic transducer has a plurality of base cells (1) arranged at least partially in a grid pattern and contacted with one another, each having at least one electrode (3) and at least one electromechanical transducer element (4), wherein a plurality of base cells (1) are arranged on a substrate (2) and form a chip (15), wherein the base cells (1) are not electrically connected to one another at the substrate level, and wherein the micromechanical ultrasonic transducer is bounded at its edge by at least one freely definable singulation line (8). (Figure 7)