Diamond coated saw wire for wire saw that is utilized for cutting hard-brittle materials into thin disks for manufacturing silicon wafers of semiconductor, has carbon fiber bundle embedded in hollow wire that is made of steel

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This patent describes a wire saw specifically designed for cutting hard and brittle materials, such as those used to manufacture thin silicon wafers. The wire consists of a strong core made from carbon fiber bundles embedded inside a hollow steel wire, with diamond particles fixed on the outer surface to enhance cutting performance.

Use CasesContent extracted from patent full text and abstract with AI.

• Cutting silicon ingots into thin wafers for semiconductor manufacturing
• Slicing other hard and brittle materials, such as ceramics or sapphire
• Precision cutting applications in electronics and photovoltaic industries

BenefitsContent extracted from patent full text and abstract with AI.

• Improved strength and durability due to the carbon fiber and steel core combination
• Enhanced cutting precision and efficiency thanks to diamond-coated surface
• Longer service life and reduced wire breakage compared to traditional wires
• Enables production of thinner and higher-quality wafers, boosting yield in semiconductor processes

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The wire (10) has a core made of a carbon fiber bundle (12) that is formed from carbon fibers (14). Diamond particles are arranged on an external periphery surface of the wire, and the fiber bundle is embedded in a hollow wire (18) that is made of steel. The fiber bundle is arranged around a metallic twisted carrier wire and embedded into a resin matrix. The diamond particles are positively retained in the hollow wire that is manufactured by extrusion process. An internal bore (16) of the hollow wire is formed according to an outer diameter of the fiber bundle. An independent claim is also included for a method for manufacturing a saw wire.