Temperature measurement device

Simple SummaryContent extracted from patent full text and abstract with AI.

The invention describes a temperature measurement device designed to provide highly accurate and reliable temperature readings at extreme temperatures, up to 1800°C. This device features a sensor element composed of specific insulating materials (with a wide band gap, e.g., ≥4 eV at room temperature) that become semiconducting only at high temperatures, coupled with special contact and encapsulation components that also withstand high heat. The sensor is encapsulated in a gas-tight housing to protect it, and is electrically connected to allow real-time precise measurement of high-temperature environments.

Use CasesContent extracted from patent full text and abstract with AI.

• Temperature monitoring in metallurgical processes such as steelmaking and foundries
• Controlling and optimizing processes in cement production or industrial furnaces
• Real-time temperature feedback in reactors or high-temperature chemical processes
• Temperature measurement in thermal waste treatment plants
• Quality assurance and safety monitoring during high-temperature material processing (e.g., casting, smelting)
• Evaluation of temperature profiles in research on high-temperature materials

BenefitsContent extracted from patent full text and abstract with AI.

• Enables continuous and precise temperature measurement up to 1800°C, exceeding conventional sensor capabilities
• Ensures durability and reliability, even when exposed directly to extreme heat and chemically aggressive media
• Minimizes degradation over time due to selection of high-melting-point materials
• Provides direct measurements at the point of interest, removing the need for indirect or protected placement
• Offers high accuracy (error <1%) and rapid response (quickly delivers stable readings), enhancing process control
• Gas-tight encapsulation protects sensor from environmental contamination, increasing lifespan and reliability

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The present invention relates to a temperature measuring device comprising at least one sensor element which is coupled to contact elements. Said contact elements are connected to an electrical voltage supply for applying a voltage to the sensor element and connected to a current measuring device for measuring a current flow through the sensor element. The object of the present invention is to provide a temperature measuring device which delivers consistently accurate and reliable temperature measured values at temperatures up to 1800 °C. The object is achieved according to the invention by a temperature measuring device of the aforementioned type, in which the sensor element is formed of at least one sensor material that has a band gap of ≥ 4 eV at 300 K, and/or the sensor element is formed of boron (B), gadolinium(III) oxide (Gd2O3), indium(III) oxide (In2O3), magnesium zinc oxide (MgZnO), strontium titanate (SrTiO3), titanium(IV) oxide (TiO2), zinc(II) oxide (ZnO), gallium nitride (GaN), yttrium(III) sulphide (Y2S3), aluminium phosphide (AlP), cerium hexaboride (CeB6) and/or lanthanum hexaboride (LaB6); the sensor material and the connection elements have a melting point of ≥ 1800 °C at 105 Pa; and there is provided around the sensor element a gas-tight encapsulation having an interior cavity, out of which connections of the connection elements are guided.