Induction Heating of Multiple Conductive Structures on Non-Conductive Substrates

Simple SummaryContent extracted from patent full text and abstract with AI.

The patent describes a method and device for heating multiple electrically conductive structures arranged on a non-conductive substrate. This is achieved by using an array of inductor elements positioned near the substrate, which are energized with alternating current to induce eddy currents in the conductive structures, causing them to heat up efficiently.

Use CasesContent extracted from patent full text and abstract with AI.

• Heating specific areas in microelectronic devices during manufacturing or repair
• Patterned heating of conductive traces in printed circuit boards (PCBs)
• Curing of conductive inks or pastes in printed electronics
• Selective annealing or treatment of thin metallic films on non-conductive substrates
• Manufacturing processes that require localized heating without direct physical contact

BenefitsContent extracted from patent full text and abstract with AI.

• Allows precise, localized heating without direct contact with the conductive structures
• Can heat multiple structures simultaneously, improving efficiency
• Suitable for delicate substrates that cannot withstand direct heating or mechanical stress
• Reduces the risk of contamination compared to contact-based heating methods
• Can be easily integrated into automated manufacturing lines for electronics or microdevices

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

Method for heating a plurality of electrically conductive structures (2, 4) which are arranged on an electrically non-conductive first substrate (1), comprising the steps: - Providing a first inductor (6) with a plurality of inductor elements (30) arranged side by side, wherein each inductor element has at least one first connection section (31) and at least two legs (32), wherein the first connection section (31) connects the two legs (32) of the inductor element (30) to one another, and wherein the inductor elements (30) are connected to one another in series by second connection sections (33), - Arranging the first inductor (6) above or below the first substrate (1), such that o each inductor element (30) at least partially overlaps with an edge (5) of at least one electrically conductive structure (2, 4) and/or o each inductor element at least partially runs parallel to the edge (5) of the electrically conductive structure (2, 4), - Applying an alternating current to the first inductor (6) or applying an alternating voltage to the first inductor (6), and - Inducing eddy currents in the electrically conductive structures (2, 4).