Micromechanical sensor with bandpass characteristics

Publication: EP2423654A1
Published: 2012-02-29
Family Size: 5
Granted: Yes (2/5)

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a micromechanical sensor that functions as a bandpass filter for vibration or acoustic signal detection. The sensor consists of at least two spring-mass-damper oscillators, each with a different resonant frequency. These oscillators are mechanically and electrically coupled such that they compensate for each other's influence on the sensor's output capacitance. As a result, the sensor is highly sensitive within a specific frequency range (between the two resonant frequencies), while effectively filtering out low-frequency disturbances and noise.

Use CasesContent extracted from patent full text and abstract with AI.

  • Condition monitoring and fault detection in industrial machinery (e.g., wear or anomaly detection)
  • Vibration analysis in automotive or aerospace applications
  • Seismic activity or structural health monitoring in buildings and infrastructure
  • Precision acoustic sensors for electronics or scientific instrumentation
  • Consumer electronics (e.g., noise or shock detection in smartphones)
  • Medical devices requiring precise vibration/acoustic measurement

BenefitsContent extracted from patent full text and abstract with AI.

  • Excellent suppression of low-frequency interference, increasing measurement reliability
  • High sensitivity within a defined frequency band (bandpass behavior)
  • Compact sensor design suitable for integration into small devices
  • Faster response times due to low settling time, allowing detection of short-duration events
  • Lower manufacturing costs compared to arrays of resonant sensors, while maintaining broad frequency coverage
  • Flexible implementation using established microfabrication techniques

Technical Classifications (CPCs)

Main Classifications

Physics & Measurement

Sub Classifications

Measuring & Testing

CPC Codes

G01H13/00

Inventors & Applicants

Applicants

Univ Chemnitz Tech

Patent Abstract

The sensor (1) has spring-mass vibration systems (S1,S2) having two different resonant frequencies that are oscillated in unison. The vibration electrodes (6) are vibrated in a direction of measurement electrodes, whose deflections are equal or proportional to deflections of spring-mass-damper oscillator. The vibration systems are coupled together to form capacitance (C). The capacitance is determined by electrode area and electrode spacing and/or electrode covering. The electrodes are overlapped, thus the influences on size of capacitance of vibration systems is compensated. An independent claim is included for method for detecting and measuring vibrations with micromechanical sensor.

Key Information

Publication No.

EP2423654A1

Family ID

43646175

Publication Date

2012-02-29

Application No.

EP10401151A

Application Date

2010-08-26

Priority Date

2010-08-26

Granted

Yes (2/5)

Possible Cooperation

For further information please contact the transfer office.