Making Circuit Carriers with Printed Conductors Inside an Injection Mold

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a process for manufacturing molded circuit carriers (used in electronics) entirely within an injection molding tool. The process involves applying a suspension or dispersion of conductive material onto the tool's inner surface, which dries to form a conductive layer. When molten plastic is injected, it bonds closely to the dried conductive layer, resulting in a circuit carrier with multiple layers and high-density circuit paths.

Use CasesContent extracted from patent full text and abstract with AI.

• Production of compact and complex electronic modules for automotive, consumer electronics, or industrial equipment
• Manufacturing of multi-layer circuit carriers for use in PCBs (printed circuit boards) and integrated electronic components
• Creation of lightweight, high-performance electronics with integrated circuitry for smart devices, IoT sensors, and wearable technology

BenefitsContent extracted from patent full text and abstract with AI.

• Enables high integration density of circuits within a single, molded component
• Reduces manufacturing steps and increases throughput by combining circuit formation with molding
• Improves material bonding and longevity of electronic components via enhanced adhesion
• Facilitates production of complex, multi-layer circuit structures in a single tool and operation

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a method for the complete production of an injection-molded circuit carrier within an injection-molding tool. A suspension or dispersion of a conductive material is first applied by printing technology to the inner surface of an injection-molding tool. On the tool surface, the suspension or dispersion dries to form a conductive lacquer of higher viscosity and shear strength. During the subsequent injection of a plastic melt with lower viscosity than the conductive lacquer, the latter adheres to the solidifying plastic and forms a material bond with it. The injection-molded circuit carrier produced according to the method of the invention advantageously has a multilayered structure and a high conductor track density.