Grid-Arranged Micromechanical Ultrasonic Transducer with Modular Cell Architecture
AISimple SummaryContent extracted from patent full text and abstract with AI.
This invention relates to a micromechanical ultrasound transducer (often referred to as a MEMS ultrasound transducer) with a grid-like arrangement of base cells. Each base cell includes at least one electrode and an electromechanical transducer element, and these cells are arranged on a substrate to form a chip. The base cells are electrically isolated at the substrate level, and the device is defined at the edges by separation lines on the substrate.
Use CasesContent extracted from patent full text and abstract with AI.
- Medical imaging devices, such as ultrasound scanners
- Non-destructive testing and inspection of materials
- Industrial process control using ultrasonic measurements
- Biomedical devices requiring high-resolution ultrasound sensing
- Portable or miniaturized ultrasound diagnostic tools
BenefitsContent extracted from patent full text and abstract with AI.
- Allows for compact, high-density ultrasound transducer arrays
- Improved resolution and sensitivity for imaging or detection applications
- Can be produced using microfabrication (MEMS) techniques, enabling low-cost, scalable manufacturing
- Electrical isolation of cells at the substrate enables more flexible design and better signal quality
- Applicable to both medical and industrial fields, increasing versatility
Technical Classifications (CPCs)
Main Classifications
Health, Food & Consumer Tech
Manufacturing & Transport
Physics & Measurement
Sub Classifications
Generating Mechanical Vibrations
Measuring & Testing
Medical & Vet Science
CPC Codes
Inventors & Applicants
Inventors
N/A
Applicants
Technische Univ Chemnitz Koerperschaft des Oeffentlichen Rechts
Patent Abstract
Micromechanical ultrasonic transducer, characterized in that the micromechanical ultrasonic transducer comprises a plurality of base cells arranged at least partially in a grid pattern and in contact with one another, each comprising at least one electrode and at least one electromechanical transducer, wherein a plurality of base cells are arranged on a substrate and form a chip, wherein the base cells are not connected to one another at the substrate level and in that the micromechanical ultrasonic transducer is delimited at its edges by at least one separation line.
Key Information
Publication No.
DE202023102447U1
Family ID
87160986
Publication Date
2023-06-23
Application No.
DE202023102447U
Application Date
2023-05-05
Priority Date
2023-05-05
Granted
Yes (1/1)
Possible Cooperation
For further information please contact the transfer office.