Grid-Arranged Micromechanical Ultrasonic Transducer with Modular Cell Architecture

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Publication: DE202023102447U1
Published: 2023-06-23
Family Size: 1
Granted: Yes (1/1)

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention relates to a micromechanical ultrasound transducer (often referred to as a MEMS ultrasound transducer) with a grid-like arrangement of base cells. Each base cell includes at least one electrode and an electromechanical transducer element, and these cells are arranged on a substrate to form a chip. The base cells are electrically isolated at the substrate level, and the device is defined at the edges by separation lines on the substrate.

Use CasesContent extracted from patent full text and abstract with AI.

  • Medical imaging devices, such as ultrasound scanners
  • Non-destructive testing and inspection of materials
  • Industrial process control using ultrasonic measurements
  • Biomedical devices requiring high-resolution ultrasound sensing
  • Portable or miniaturized ultrasound diagnostic tools

BenefitsContent extracted from patent full text and abstract with AI.

  • Allows for compact, high-density ultrasound transducer arrays
  • Improved resolution and sensitivity for imaging or detection applications
  • Can be produced using microfabrication (MEMS) techniques, enabling low-cost, scalable manufacturing
  • Electrical isolation of cells at the substrate enables more flexible design and better signal quality
  • Applicable to both medical and industrial fields, increasing versatility

Technical Classifications (CPCs)

Main Classifications

Health, Food & Consumer Tech

Manufacturing & Transport

Physics & Measurement

Sub Classifications

Generating Mechanical Vibrations

Measuring & Testing

Medical & Vet Science

CPC Codes

A61B8/4477A61B8/4483A61B8/4494B06B1/0207G01H11/06G01N29/2406

Inventors & Applicants

Inventors

N/A

Applicants

Technische Univ Chemnitz Koerperschaft des Oeffentlichen Rechts

Patent Abstract

Micromechanical ultrasonic transducer, characterized in that the micromechanical ultrasonic transducer comprises a plurality of base cells arranged at least partially in a grid pattern and in contact with one another, each comprising at least one electrode and at least one electromechanical transducer, wherein a plurality of base cells are arranged on a substrate and form a chip, wherein the base cells are not connected to one another at the substrate level and in that the micromechanical ultrasonic transducer is delimited at its edges by at least one separation line.

Key Information

Publication No.

DE202023102447U1

Family ID

87160986

Publication Date

2023-06-23

Application No.

DE202023102447U

Application Date

2023-05-05

Priority Date

2023-05-05

Granted

Yes (1/1)

Possible Cooperation

For further information please contact the transfer office.