Method and Device for Evaluating Electrically Conductive Printed Structures and Printing Machine with Such a Device

Publication: DE102007052609A1
Published: 2009-05-07
Family Size: 2
Granted: No

Simple SummaryContent extracted from patent full text and abstract with AI.

The patent discloses a method and apparatus for evaluating electrically conductive, printed structures (such as those used in flexible electronic circuits) directly during their production on a moving web (e.g., foil or paper) in a printing machine. It uses inline measurement rollers with ring electrodes to accurately and non-destructively measure parameters like electrical resistance and short-circuit robustness of the printed structures. The data is wirelessly transmitted, allowing real-time quality control and the possibility of automatic process adjustments within the printing machine.

Use CasesContent extracted from patent full text and abstract with AI.

  • Inline quality control for the mass production of printed electronic circuits (e.g., RFID, flexible sensors, printed transistors).
  • Manufacturing of smart packaging with embedded electronics where electrical properties must be assured during printing.
  • Production of flexible displays, wearable electronics, or medical patches that incorporate printed conductive paths.
  • Any printing process (offset, flexographic, gravure, screen printing) producing conductive patterns requiring real-time monitoring and automated feedback for defect reduction.
  • Integration in existing printing machines to upgrade them for electronic component manufacturing.

BenefitsContent extracted from patent full text and abstract with AI.

  • Enables real-time, non-destructive quality assessment of printed electronic structures during high-speed manufacturing.
  • Immediate detection and marking of defects, reducing waste and unnecessary downstream processing costs.
  • Wireless transmission of measurement data ensures operational flexibility and safety in high-speed environments.
  • Closed-loop feedback allows for automatic adjustments in the printing process, improving overall yield and consistency.
  • Eliminates the need for additional test fields or manual sampling, thus streamlining the production workflow.
  • Supports high-resolution and high-speed production lines critical for electronics mass markets (e.g., smart labels, flexible circuits).

Technical Classifications (CPCs)

Main Classifications

Electrical & Electronic Tech

Physics & Measurement

Sub Classifications

Electric Techniques (Other)

Measuring & Testing

CPC Codes

G01N27/041G01R27/02H05K1/0268H05K3/12

Inventors & Applicants

Applicants

Printed Systems Gmbh

Univ Chemnitz Tech

Patent Abstract

The invention relates to a method for evaluating electrically conductive, printed structures and to a device, particularly for executing such a method, and to a printing machine (4) comprising such a device. The invention provides for the printing of electrically conductive structures, such as transistors, for the production of electronic circuits and a link-line conductivity test, preferably transversal to the running direction of the web material (2) running through the printing machine by means of one or more measuring rollers (11), which are provided with spaced ring electrodes for measuring the electric resistance or also for testing the short circuit strength in contact with the printed electrically conductive structure. The measuring signals are wirelessly transmitted to a receiver device (15) and can also be used in a closed control loop for influencing the printing parameters or the control technology of the printing machine.

Key Information

Publication No.

DE102007052609A1

Family ID

40340485

Publication Date

2009-05-07

Application No.

DE102007052609A

Application Date

2007-11-05

Priority Date

2007-11-05

Granted

No

Possible Cooperation

For further information please contact the transfer office.