Method for Electrical Coupling and Electric Coupling Arrangement

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a method and arrangement for creating an electrical connection between a pad and the front face of a pillar using a suspension containing conductive microparticles and nanoparticles. The process involves shaping the components, applying the suspension, positioning the parts, evaporating the fluid so that conductive particles remain as bridges, and then sintering them to create durable metallic bonds for efficient electrical coupling.

Use CasesContent extracted from patent full text and abstract with AI.

• Connecting semiconductor components in microelectronics.
• Fine-pitch connections in integrated circuits and chips.
• Manufacturing advanced printed circuit boards (PCBs).
• Creating miniaturized and reliable interconnections in medical devices.
• Assembly of flexible or wearable electronics.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables strong and low-resistance electrical connections at microscale.
• Improves connection reliability and durability through metallic sintering.
• Allows for precise, high-density interconnections suitable for advanced electronics.
• Can be integrated into various manufacturing processes for small electronic devices.
• Reduces the need for traditional soldering, potentially lowering thermal stress on components.

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Patent Abstract

A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.