Soldering Fiber-Composite Parts to Metal Using Channels that Drain Excess Flux

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention relates to a method for creating strong, bonded solder joints on fiber-reinforced composite materials. It involves forming special channel-shaped grooves on the surface of a component, coating or filling these grooves with metal to create elevated metal contours, and then carrying out soldering. These grooves act as pathways to guide excess flux away during the soldering process, ensuring improved solder joint quality.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of electronic components using fiber-reinforced composites
• Automobile or aerospace assembly involving soldering of composite material parts
• Production of circuit boards with enhanced solder joint reliability
• Soldering structural components in advanced engineering applications

BenefitsContent extracted from patent full text and abstract with AI.

• Improves the quality and strength of solder joints on fiber-reinforced composite materials
• Effectively removes excess solder flux, reducing residue and defects
• Enables reliable soldering of complex-shaped components
• Reduces the risk of weak or contaminated joints, increasing product lifespan and reliability

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

In the method, a layer (1.1) of a metal or contour elements (1.2) with a metal, which form elevations, are applied at least to the surface of a first component (3), on which the solder joint is formed. For this purpose, channel-shaped trenches (4) are formed in the fiber composite material and subsequently the surface is coated with a metal such that channel-shaped recesses (2) are formed in the region of the trenches (4), or the channel-shaped trenches (4) are filled with metal, so that contour elements (1.2) are formed with the metal. Channel-shaped recesses (2) are formed between contour elements (1.2). The channel-shaped recesses (2) have a minimum depth of 20 µm and a minimum width of 10 µm. The respective opening of the channel-shaped recesses (2) is arranged at the outer edge of the solder joint to be formed or extending beyond it. Subsequently, the solder joint is formed and excess flux is discharged through the channel-shaped recesses (2).