Laser Bonding of Micro-Components and Thin Films with Minimal Heat Damage

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention relates to methods and devices for joining microscale objects or thin films on substrates by creating a strong material bond using ultrafast pulsed lasers (ultrashort pulse lasers). The process achieves precise, high-resolution connections with minimal heat impact, making it especially suitable for delicate or heat-sensitive microcomponents and microstructures.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of microelectronic devices and sensors
• Assembly of MEMS (Micro-Electro-Mechanical Systems) components
• Bonding thin films in semiconductor or optoelectronic devices
• Fabrication of microfluidic chips and lab-on-chip systems
• Precision repair or modification of microstructures in scientific equipment

BenefitsContent extracted from patent full text and abstract with AI.

• Minimal thermal damage to surrounding materials, preserving sensitive components
• High geometric resolution allows for precise and small-scale joining
• Enables strong, robust material connections (metallurgical bonding)
• Suitable for a wide range of advanced micro-assembly tasks and emerging microsystem technologies
• Greater flexibility and control compared to traditional thermal joining methods

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to methods and devices for material-bonded joining of microbodies or of thin layers arranged on bodies or of a microbody with a thin layer arranged on a body, and to a microsystem realized using an ultrashort pulse laser. These are characterized in particular by the fact that a material-bonded joint connection is formed between the bodies and/or the layers with low thermal stress and high geometric resolution. For this purpose, by irradiating a joint gap with a laser beam of the high-repetition-rate ultrashort pulse laser, at least one microbody and/or at least one thin layer is heated to a temperature greater than the melting temperature of the respective material such that, depending on the scanning speed of the laser beam over the joint gap and the average power of the laser, more material of a region of the microbodies, the thin layers or the microbody and the thin layer as the region of the joint connection melts than evaporates and the melted regions of the microbodies or the thin layers or the microbody and the thin layer bond together in a material-bonded manner.