Sensor module for component for detecting stresses on component, has three dimensional carrier material, piezo element, wire sensor and electronics connected with piezo element

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This patent describes a sensor module designed to detect mechanical stresses in a component. The module includes a three-dimensional carrier material, a piezoelectric element, a specialized wire sensor capable of detecting stress in all three spatial dimensions, and electronics that process the signals from the piezo element. The wire sensor can distinguish between different types of distortions or stresses within the component.

Use CasesContent extracted from patent full text and abstract with AI.

• Monitoring structural integrity in aerospace or automotive components
• Detecting stress and strain in civil infrastructure such as bridges or buildings
• Quality control during manufacturing of mechanical parts
• Early detection of damage or fatigue in machinery and industrial equipment

BenefitsContent extracted from patent full text and abstract with AI.

• Provides comprehensive stress detection in all three dimensions
• Improves safety by enabling early detection of potential failures
• Allows for real-time monitoring and data collection
• Enhances maintenance efficiency by accurately identifying stressed or damaged areas
• Can be integrated into various types of structures and components

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The sensor module (1) has a three dimensional carrier material (2), a piezo element (3), a wire sensor (4) and an electronics (5) connected with the piezo element. The wire sensor is designed for detecting all three dimensional spatial mechanical stress components. The wire sensor differentiates between each of the distortion components. Independent claims are included for the following: (1) a manufacturing method for sensor module for a component for detecting stresses on component; and (2) a method for recording and processing of the signals with a sensor module.